| |
|
|
|
|
|
|
|
|
Rogers RT/duroid 5870 High Frequency PCB: Available in thicknesses of 10mil, 20mil, 31mil and 62mil, with Immersion Gold |
|
|
|
|
|
(As PCBs are custom - produced goods, the picture and parameters shown are only intended for reference.) |
|
|
|
|
|
Hello, everyone!
Today, we're presenting a high - frequency printed circuit board (PCB) crafted using RT/duroid 5870 laminates.
RT/duroid 5870, a glass microfiber - reinforced PTFE composite developed by Rogers Corporation, is specifically engineered for demanding stripline and microstrip circuit applications. This material offers unique properties that make it an ideal choice for high - frequency PCB designs, enabling precise signal transmission and enhanced performance in various electronic systems. |
|
|
|
|
|
.jpg) |
|
|
|
|
|
Let's see the reasons for using RT/duroid 5870 material. |
|
|
1. The randomly oriented microfibers within RT/duroid 5870 laminates lead to remarkable dielectric constant uniformity.
2. RT/duroid 5870 laminates exhibit a consistent dielectric constant not only from one panel to another but also remain stable across a broad frequency spectrum.
3. Thanks to its low dissipation factor, the usability of RT/duroid 5870 laminates can be extended up to the Ku - band and even higher frequency bands.
4. RT/duroid 5870 laminates are specifically designed for applications involving microstrip and stripline circuitry. |
|
|
|
|
Our PCB Capability (RT/duroid 5870) |
|
|
Our PCB Capability(RO4350B) Double sided circuit boards on RO4350B are available in a variety of thicknesses, such as 10mil, 20mil, 30mil and 60mil. It's used in a variety of typical and non-traditional microwave / radio frequency applications, such as base station antennas, attenuator, power amplifiers, RFID, radar and sensors etc.
|
|
|
PCB Material: |
Glass microfiber reinforced PTFE composites |
Designator: |
RT/duroid 5870 |
Dielectric constant: |
2.33 ±0.02 (process) |
|
2.33 (design) |
Layer count: |
1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed) |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 20mil (0.508mm) |
|
31mil (0.787mm), 62mil (1.575mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin, OSP. |
|
|
|
|
|
|
RT/duroid 5870 finds extensive application in double - sided PCBs, multilayer PCBs, and hybrid PCBs. For double - sided PCBs, it comes in a diverse range of thicknesses, including 10mil, 20mil, 31mil, and 62mil. When it comes to surface finishes, there are multiple options at your disposal, such as bare copper, HASL, ENIG, Immersion Tin, and OSP. |
|
|
|
|
|
.jpg) |
|
|
|
|
|
Typical applications of this material include microstrip and stripline circuits. It is also widely used in commercial airline broadband antennas, playing a crucial role in enabling in - flight connectivity. In the field of radar systems, it contributes to accurate detection and tracking capabilities. Additionally, it finds application in millimeter - wave applications, which are essential for high - speed data transfer and advanced sensing. Point - to - point digital radio antennas also rely on this material to ensure reliable and efficient wireless communication. |
|
|
|
|
|
 |
|
|
The fundamental color of the RT/duroid 5870 PCB is black.
Our company specializes in offering prototype development, small - batch manufacturing, and large - scale mass production services.
Should you have any queries, be it regarding product specifications, production timelines, or pricing details, please do not hesitate to reach out to us.
Thank you for taking the time to read this information.
|
|
|
Appendix: Properties of RT/duroid 5870 |
|
|
RT/duroid 5870 Typical Value |
Property |
RT/duroid 5870 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
2.33
2.33±0.02 spec. |
Z |
N/A |
C24/23/50
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
Dielectric Constant,εDesign |
2.33 |
Z |
N/A |
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0005
0.0012 |
Z |
N/A |
C24/23/50
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
Thermal Coefficient of ε |
-115 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
2 x 107 |
Z |
Mohm cm |
C/96/35/90 |
ASTM D 257 |
Surface Resistivity |
3 x 107 |
Z |
Mohm |
C/96/35/90 |
ASTM D 257 |
Specific Heat |
0.96(0.23) |
N/A |
j/g/k
(cal/g/c) |
N/A |
Calculated |
Tensile Modulus |
Test at 23℃ |
Test at 100℃ |
N/A |
MPa(kpsi) |
A |
ASTM D 638 |
1300(189) |
490(71) |
X |
1280(185) |
430(63) |
Y |
Ultimate Stress |
50(7.3) |
34(4.8) |
X |
42(6.1) |
34(4.8) |
Y |
Ultimate Strain |
9.8 |
8.7 |
X |
% |
9.8 |
8.6 |
Y |
Compressive Modulus |
1210(176) |
680(99） |
X |
MPa(kpsi) |
A |
ASTM D 695 |
1360(198) |
860(125) |
Y |
803(120) |
520(76) |
Z |
Ultimate Stress |
30(4.4) |
23(3.4） |
X |
37(5.3) |
25(3.7) |
Y |
54(7.8) |
37(5.3) |
Z |
Ultimate Strain |
4 |
4.3 |
X |
% |
3.3 |
3.3 |
Y |
8.7 |
8.5 |
Z |
Moisture Absorption |
0.02 |
N/A |
% |
0.62"(1.6mm) D48/50 |
ASTM D 570 |
Thermal Conductivity |
0.22 |
Z |
W/m/k |
80℃ |
ASTM C 518 |
Coefficient of Thermal Expansion |
22
28
173 |
X
Y
Z |
ppm/℃ |
0-100℃ |
IPC-TM-650 2.4.41 |
Td |
500 |
N/A |
℃ TGA |
N/A |
ASTM D 3850 |
Density |
2.2 |
N/A |
gm/cm3 |
N/A |
ASTM D 792 |
Copper Peel |
27.2(4.8) |
N/A |
Pli(N/mm) |
1oz(35mm)EDC foil
after solder float |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
N/A |
N/A |
N/A |
UL 94 |
Lead-free Process Compatible |
Yes |
N/A |
N/A |
N/A |
N/A |
|
|
|
|
|
|
|
|
|
Hot Tags:
Rogers RT/duroid 5870 Material |
RT/duroid 5870 for Sale |
RT/duroid 5870 PCB Thickness |
Rogers RT/duroid 5870 Substrate |
RT/duroid 5870 Datasheet |
|
|
|
