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Rogers RT/Duroid 5870 High Frequency 15mil 0.381mm PCB with Immersion Gold Surface Finish  

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

 
   

Rogers RT/duroid 5870 is a high-frequency material composed of glass microfiber reinforced PTFE composites, specifically engineered for demanding stripline and microstrip circuit applications. This material boasts exceptional dielectric constant uniformity, attributed to its randomly oriented microfibers, ensuring that the dielectric constant remains consistent across different panels and stable over a broad frequency range. Its low dissipation factor enhances its applicability to Ku-band frequencies and beyond. Additionally, RT/duroid 5870 can be easily cut, sheared, and machined into various shapes, and it exhibits resistance to all solvents and reagents typically used in the etching of printed circuits or in the plating of edges and holes.

 

Typical applications for RT/duroid 5870 include:

Commercial airline broadband antennas

Microstrip circuits

Stripline circuits

Millimeter wave applications

Military radar systems

Missile guidance systems

Point-to-point digital radio antennas

 
   
 
   
PCB Specifications  

 

PCB SIZE

95 x 67mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 35um(1 oz)+plate TOP layer

 

RT/duroid 5870 0.381mm

 

copper ------- 35um(1oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

5.5 mil / 5 mil

Minimum / Maximum Holes:

0.3 mm / 5.2 mm

Number of Different Holes:

9

Number of Drill Holes:

102

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RT/duroid 5870 0.381mm

Final foil external:

1.5 oz

Final foil internal:

N/A

Final height of PCB:

0.4 mm ±0.1

PLATING AND COATING

 

Surface Finish

ENIG

Solder Mask Apply To:

NO

Solder Mask Color:

NO

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

NO

Colour of Component Legend

NO

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.3mm. Solder mask uncovered

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.

 

 
Data Sheet of Rogers RT/duroid 5870

RT/duroid 5870 Typical Value

Property

RT/duroid 5870

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.33
2.33±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.33

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0005
0.0012

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-115

Z

ppm/

-50to 150

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 107

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

3 x 107

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23)

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23

Test at 100

N/A

MPa(kpsi)

A

ASTM D 638

 

1300(189)

490(71)

X

 

 

 

 

1280(185)

430(63)

Y

 

 

 

Ultimate Stress

50(7.3)

34(4.8)

X

 

 

 

 

42(6.1)

34(4.8)

Y

 

 

 

Ultimate Strain

9.8

8.7

X

%

 

 

 

9.8

8.6

Y

 

 

 

Compressive Modulus

1210(176)

680(99

X

MPa(kpsi)

A

ASTM D 695

 

1360(198)

860(125)

Y

 

 

 

 

803(120)

520(76)

Z

 

 

 

Ultimate Stress

30(4.4)

23(3.4

X

 

 

 

 

37(5.3)

25(3.7)

Y

 

 

 

 

54(7.8)

37(5.3)

Z

 

 

 

Ultimate Strain

4

4.3

X

%

 

 

 

3.3

3.3

Y

 

 

 

 

8.7

8.5

Z

 

 

 

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.22

Z

W/m/k

80

ASTM C 518

Coefficient of Thermal Expansion

22
28
173

X
Y
Z

ppm/

0-100

IPC-TM-650 2.4.41

Td

500

N/A

 TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm3

N/A

ASTM D 792

Copper Peel

27.2(4.8)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A

 
   
   
   
   
   
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