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Rogers RO4535 Antenna PCB 60mil 30mil 20mil High Frequency Printed Circuit Board with Immersion Gold, Silver and Tin |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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General Description |
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Rogers RO4535 PCB utilizes ceramic-filled, glass-reinforced hydrocarbon materials engineered by Rogers Corporation to deliver cost-effective solutions for antenna applications. The RO4535 PCB material system is precision-designed to address the exacting demands of modern antenna designs while maintaining competitive pricing.
Rogers RO4535 PCB demonstrates exceptional electrical performance with a dielectric constant of 3.44 and loss tangent of 0.0037 at 10 GHz, enabling antenna designers to maximize gain while minimizing signal loss. Rogers RO4535 PCB technology delivers superior passive intermodulation (PIM) characteristics, making it particularly effective for microstrip antennas in mobile communication infrastructure.
As an economical alternative to conventional PTFE-based solutions, RO4535 PCB achieves optimal cost-performance balance for antenna systems. The Rogers RO4535 PCB material features CTE values in X/Y directions that closely align with copper, significantly reducing mechanical stress in antenna structures. Through its tailored resin formulation and thermal compatibility, RO4535 PCB enhances antenna reliability while maintaining electrical stability across operating conditions. |
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Features and Benefits |
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1. Low Loss 0.0037 , Low Dk 3.44, low PIM response: Wide range of application use
2. Thermoset resin system: Compatible with standard PCB fabrication
3. Excellent dimensional stability: Greater yield on larger panels sizes
4. Uniform mechanical properties: Maintains mechanical form during handling
5. High thermal conductivity: Improved power handling |
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Typical applications: |
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1. Cellular infrastructure base station antennas
2. WiMAX antenna networks |
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Our PCB Capability (RO4535) |
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PCB Capability (RO4535) |
PCB Material: |
Ceramic-filled, Glass-reinforced Hydrocarbon |
Designation: |
RO4535 |
Dielectric constant: |
3.44 |
Dissipation Factor |
0.0037 10GHz |
Layer count: |
Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Laminate thickness: |
20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold plated etc.. |
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RO4535 Typical Values |
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Property |
RO4535 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant, er Process |
3.44 ± 0.08 |
Z |
- |
10 GHz/23℃ 2.5 GHz |
IPC-TM-650,2.5.5.5 |
Dissipation Factor |
0.0032 |
Z |
- |
2.5 GHz/23℃ |
IPC-TM-650, 2.5.5.5 |
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0.0037 |
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10 GHz/23℃ |
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PIM (Typical) |
-157 |
- |
dBc |
Reflected 43 dBm swept tones |
Summitek 1900b PIM Analyzer |
Dielectric Strength |
>500 |
Z |
V/mil |
0.51 mm |
IPC-TM-650, 2.5.6.2 |
Dimensional Stability |
<0.5 |
X,Y |
mm/m (mils/inch) |
after etch |
IPC-TM-650, 2.4.39A |
Coefficient of Thermal Expansion |
16 |
X |
ppm/℃ |
-55 to 288℃ |
IPC-TM-650, 2.4.41 |
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17 |
Y |
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50 |
Z |
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Thermal Conductivity |
0.6 |
- |
W/(m.K) |
80℃ |
ASTM C518 |
Moisture Absorption |
0.09 |
- |
% |
D48/50 |
IPC-TM-650, 2.6.2.1 ASTM D570 |
Tg |
>280 |
- |
℃ TMA |
A |
IPC-TM-650, 2.4.24.3 |
Density |
1.9 |
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gm/cm3 |
- |
ASTM D792 |
Copper Peel Strength |
5.1 （0.9） |
- |
lbs/in (N/mm) |
1 oz. EDC post solder float |
IPC-TM-650, 2.4.8 |
Flammability |
V-0 |
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- |
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UL 94 |
Lead-Free Process Compatible |
Yes |
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Hot Tags:
Rogers RO4535 Printed Circuit Board |
Rogers High Frequency PCB |
60mil 30mil 20mil RO4535 PCB |
Rogers RO4535 Antenna PCB |
RO4535 Immersion Silver PCB |
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