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Rogers RO4534 PCB 20mil 30mil 60mil Circuit Board with ENIG and Immersion Tin for Microstrip Antenna |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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General Description |
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Rogers RO4534 PCBs, built with ceramic-filled, glass-reinforced hydrocarbon-based materials, stand out as a top choice for cost-efficient yet high-performance antenna solutions. Rogers RO4534 PCBs feature a dielectric constant of 3.4 and a 10 GHz loss tangent (Df) of 0.0027, allowing antenna designers to maximize gain while minimizing signal loss. This makes the RO4534 laminate an excellent fit for mobile infrastructure microstrip antennas requiring superior passive intermodulation response.
Compared to traditional PTFE antenna technologies, Rogers RO4534 High Frequency PCB offers an economical alternative that helps designers strike the right balance between cost and performance. The resin systems of RO4534 dielectric materials are specially formulated to ensure optimal antenna performance. Additionally, its X and Y thermal expansion coefficients (CTEs) closely match those of copper, effectively reducing stresses in printed circuit board antennas and enhancing their durability and reliability over time. |
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Features and Benefits |
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1. Low Loss 0.0027 , Low Dk 3.4, low PIM response: Wide range of application use
2. Thermoset resin system: Compatible with standard PCB fabrication
3. Excellent dimensional stability: Greater yield on larger panels sizes
4. Uniform mechanical properties: Maintains mechanical form during handling
5. High thermal conductivity: Improved power handling |
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Typical applications: |
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1. Cellular infrastructure base station antennas
2. WiMAX antenna networks |
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Our PCB Capability (RO4534 PCB) |
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PCB Capability (RO4534) |
PCB Material: |
Ceramic-filled, Glass-reinforced Hydrocarbon |
Designation: |
RO4534 |
Dielectric constant: |
3.4 |
Dissipation Factor |
0.0027 10GHz |
Layer count: |
Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Laminate thickness: |
20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEIPIG, OSP, Pure gold plated etc.. |
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RO4534 Typical Values |
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Property |
RO4534 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant, er Process |
3.4 ± 0.08 |
Z |
- |
10 GHz/23℃ 2.5 GHz |
IPC-TM-650,2.5.5.5 |
Dissipation Factor |
0.0022 |
Z |
- |
2.5 GHz/23℃ |
IPC-TM-650, 2.5.5.5 |
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0.0027 |
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10 GHz/23℃ |
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PIM (Typical) |
-157 |
- |
dBc |
Reflected 43 dBm swept tones |
Summitek 1900b PIM Analyzer |
Dielectric Strength |
>500 |
Z |
V/mil |
0.51 mm |
IPC-TM-650, 2.5.6.2 |
Dimensional Stability |
<0.3 |
X,Y |
mm/m (mils/inch) |
after etch |
IPC-TM-650, 2.4.39A |
Coefficient of Thermal Expansion |
11 |
X |
ppm/℃ |
-55 to 288℃ |
IPC-TM-650, 2.4.41 |
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14 |
Y |
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46 |
Z |
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Thermal Conductivity |
0.6 |
- |
W/(m.K) |
80℃ |
ASTM C518 |
Moisture Absorption |
0.06 |
- |
% |
D48/50 |
IPC-TM-650, 2.6.2.1 ASTM D570 |
Tg |
>280 |
- |
℃ TMA |
A |
IPC-TM-650, 2.4.24.3 |
Density |
1.8 |
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gm/cm3 |
- |
ASTM D792 |
Copper Peel Strength |
6.3 （1.1） |
- |
lbs/in (N/mm) |
1 oz. EDC post solder float |
IPC-TM-650, 2.4.8 |
Flammability |
NON FR |
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UL 94 |
Lead-Free Process Compatible |
Yes |
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Hot Tags:
Rogers RO4534 Printed Circuit Board |
RO4534 High Frequency PCB |
Rogers RO4534 Immersion Gold PCB |
Rogers RO4534 Immersion Tin PCB |
Rogers RO4534 20mil 30mil 60mil PCB |
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