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Rogers RO4003C 32mil 0.813mm High Frequency PCB with Immersion Gold for Filters  

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

 
   

 

RO4003C hydrocarbon ceramic laminates are engineered to provide exceptional high-frequency performance and cost-effective circuit manufacturing. As operational frequencies rise above 500 MHz, designers face a significantly limited selection of laminates. However, RO4003C material possesses the necessary properties for RF microwave circuits, matching networks, and controlled impedance transmission lines. Its low dielectric loss makes it suitable for applications where conventional circuit board materials are restricted by higher operating frequencies. Furthermore, RO4003C boasts one of the lowest temperature coefficients of the dielectric constant among circuit board materials, maintaining stability across a wide frequency range. The material's thermal coefficient of expansion (CTE) offers several advantages to PCB designers, as it is similar to copper, ensuring excellent dimensional stability essential for multi-layer boards with mixed dielectrics. Additionally, RO4003C's low Z-axis CTE guarantees reliable plated through-hole quality, even in extreme thermal shock conditions. With a Tg of over 280°C, RO4003C maintains stable expansion characteristics throughout the entire PCB processing temperature range.

 

 
RO4003C PCB Specifications  

High Frequency PCB Rogers 32mil 0.813mm RO4003C Double Sided RF PCB for Filters

 

 

PCB SIZE

98 x 72mm=1PCS

BOARD TYPE

 

Number of Layers

Double sided PCB

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 35um(1oz)+PLATE

 

RO4003C 32 mil 0.813mm

 

copper ------- 35um(1oz)+PLATE

TECHNOLOGY

 

Minimum Trace and Space:

6.98mil/6.28mil

Minimum / Maximum Holes:

0.3/1.2mm

Number of Different Holes:

5

Number of Drill Holes:

481

Number of Milled Slots:

0

Number of Internal Cutouts:

1

Impedance Control

no

BOARD MATERIAL

 

Glass Epoxy:

RO4003C 32 mil (0.813mm), Tg 288

Final foil external:

1.5oz

Final foil internal:

0oz

Final height of PCB:

0.9 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion Gold

Solder Mask Apply To:

NO

Solder Mask Color:

NO

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

NO

Colour of Component Legend

NO

Manufacturer Name or Logo:

N/A

VIA

Plated Through Hole(PTH)

FLAMIBILITY RATING

N/A

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059" (0.15mm)

Board plating:

0.0030" (0.076mm)

Drill tolerance:

0.002" (0.05mm)

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.

 
   

Typical applications:

Automotive Radar and Sensors

Cellular Base Station Antennas

Direct Broadcast Satellites

Low Noise Block

Power amplifiers

RFID

 
   
 

 

Data sheet of Rogers 4003C (RO4003C)

 

RO4003C Typical Value

Property

RO4003C

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

3.38±0.05

Z

 

10 GHz/23

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3.55

Z

 

8 to 40 GHz

Differential Phase Length Method

Dissipation Factortan,δ

0.0027
0.0021

Z

 

10 GHz/23
2.5 GHz/23

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

+40

Z

ppm/

-50to 150

IPC-TM-650 2.5.5.5

Volume Resistivity

1.7 x 1010

 

MΩ.cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

4.2 x 109

 

COND A

IPC-TM-650 2.5.17.1

Electrical Strength

31.2(780)

Z

Kv/mm(v/mil)

0.51mm(0.020")

IPC-TM-650 2.5.6.2

Tensile Modulus

19,650(2,850)
19,450(2,821)

X
Y

MPa(ksi)

RT

ASTM D 638

Tensile Strength

139(20.2)
100(14.5)

X
Y

MPa(ksi)

RT

ASTM D 638

Flexural Strength

276
(40)

 

MPa
(kpsi)

 

IPC-TM-650 2.4.4

Dimensional Stability

<0.3

X,Y

mm/m
(mil/inch)

after etch+E2/150

IPC-TM-650 2.4.39A

Coefficient of Thermal Expansion

11
14
46

X
Y
Z

ppm/

-55to288

IPC-TM-650 2.4.41

Tg

>280

 

 TMA

A

IPC-TM-650 2.4.24.3

Td

425

 

 TGA

 

ASTM D 3850

Thermal Conductivity

0.71

 

W/M/oK

80

ASTM C518

Moisture Absorption

0.06

 

%

48hrs immersion 0.060"
sample Temperature 50

ASTM D 570

Density

1.79

 

gm/cm3

23

ASTM D 792

Copper Peel Stength

1.05
(6.0)

 

N/mm
(pli)

after solder float 1 oz.
EDC Foil

IPC-TM-650 2.4.8

Flammability

N/A

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 

 

 

 

 

 

 
   
Hot Tags:

Rogers RO4003C FR4

RO4003C RF Microwave Circuits

32mil RO4003C High Frequency PCB

Rogers RO4003C for Filters

Low CTE RO4003C PCB Board

 

 

 

 

 
   
 
                                     
       
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