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Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver |
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(As PCBs are custom - produced goods, the picture and parameters shown are only intended for reference.) |
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Hello Everyone,
Today, we’re discussing RO3210 high-frequency PCBs.
RO3210 high-frequency circuit laminates are ceramic-filled boards reinforced with woven fiberglass. This material is an extension of the RO3000 series, featuring one key enhancement: improved mechanical stability. |
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The features and benefits of RO3210 high-frequency PCBs are as follows:
1. Woven Glass Reinforcement: Enhances rigidity for easier handling.
2. Uniform Electrical and Mechanical Performance: Ideal for complex multi-layer high-frequency structures.
3. Low In-Plane Expansion Coefficient: Matches that of copper, ensuring reliability for surface-mounted assemblies and compatibility with epoxy multi-layer hybrid designs.
4. Excellent Dimensional Stability: Contributes to high production yields.
5. Smooth Surface: Facilitates finer line etching tolerances. |
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Our PCB Capability (RO3210) |
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PCB Capability (RO3210) |
PCB Material: |
Ceramic-filled Laminates Reinforced with Woven Fiberglass |
Designation: |
RO3210 |
Dielectric constant: |
10.2±0.5 |
Layer count: |
Single Layer, Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
25mil(0.635mm), 50mil (1.27mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, Immersion tin, Immersion silver, Immersion gold, Pure gold, ENEPIG, OSP etc.. |
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Double-layer RO3210 high-frequency PCBs are available with finished copper weights ranging from 0.5oz to 2oz, and thicknesses of 0.7mm and 1.3mm. The maximum size is 400mm by 500mm, with surface finishes including bare copper, hot air leveling, and immersion gold. |
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Typical applications
1. Automotive collision avoidance systems.
2. Automotive global positions satellite antennas
3. Base station infrastructure
4. Datalink on cable systems
5. Direct broadcast satellite
6. LMDS and wireless broadband
7. Microstrip patch antennas for wireless communications
8. Power backplanes
9. Remote meter readers
10. Wireless telecommunications systems |
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RO3210 PCB features a white base color.
The manufacturing process of RO3210 high - frequency PCB closely resembles that of standard PTFE PCB. This similarity makes it highly adaptable to high - volume manufacturing processes, providing a competitive edge in the market.
If you have any inquiries or concerns, don't hesitate to get in touch with us.
Thank you for taking the time to read this. |
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Appendix: RO3210 Data Sheet |
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Property |
Typical Value RO3210 |
Direction |
Unit |
Condition |
Test Method |
Dielectric Constant, er Process |
10.2± 0.50 |
Z |
- |
10 GHz 23°C |
IPC-TM-650 2.5.5.5
Clamped Stripline |
Dielectric Constant, er Design |
10.8 |
Z |
- |
8 GHz - 40 GHz |
Differential Phase Length Method |
Dissipation Factor, tan d |
0.0027 |
Z |
- |
10 GHz 23°C |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of er |
-459 |
Z |
ppm/°C |
10 GHz 0-100°C |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.8 |
X,Y |
mm/m |
COND A |
ASTM D257 |
Volume Resistivity |
103 |
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MW•cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
103 |
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MW |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
579
517 |
MD CMD |
kpsi |
23°C |
ASTM D638 |
Water Absorption |
<0.1 |
- |
% |
D24/23 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.79 |
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J/g/K |
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Calculated |
Thermal Conductivity |
0.81 |
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W/m/K |
80°C |
ASTM C518 |
Coefficient of Thermal Expansion (-55 to 288 °C) |
13
34 |
X,Y, Z |
ppm/°C |
23°C/50% RH |
IPC-TM-650 2.4.41 |
Td |
500 |
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°C |
TGA |
ASTM D3850 |
Color |
Off White |
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Density |
3.0 |
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gm/cm3 |
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Copper Peel Strength |
11.0 |
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pli |
1 oz. EDC
After Solder Float |
IPC-TM-2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead Free Process Compatible |
YES |
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Hot Tags:
RO3210 Immersion Tin |
RO3210 Printed Circuit Board |
RO3210 Immersion Gold |
25 50 Mil Rogers RO3210 PCB |
Rogers RO3210 Immersion Silver |
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