(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

For high-frequency PCB designs requiring consistent performance and affordability, Rogers RO3203 ceramic-filled laminates offer an optimized solution. Their 3.02 Dk and 0.0016 Df ensure minimal signal distortion even beyond 40 GHz, while the woven-glass reinforcement provides mechanical strength.

The PTFE-based smooth surface of Rogers RO3203 substrate allows for high-precision etching, and compatibility with standard fabrication methods reduces production complexity. Choose from 17, 35, or 70 µm copper cladding ， all manufactured in ISO 9002-certified facilities for guaranteed quality.

1. Woven glass reinforcement improves rigidity for easier handling.

2. Uniform electrical and mechanical performance is ideal for complex multilayer high frequency structures.

3. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz.

4. Excellent mechanical properties over a wide range of dielectric constants are ideal for multilayer board designs.

5. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs

and reliable surface mounted assemblies.

6. Excellent dimensional stability for high production yields.

7. Economically priced for volume manufacturing.

8. Surface smoothness allows for finer line etching tolerances

1. Automotive Collision Avoidance Systems

2. Automotive Global Positioning Satellite Antennas

3. Base Station Infrastructure

4. Datalink on Cable Systems

5. Direct Broadcast Satellites

6. LMDS and Wireless Broadband

7. Microstrip Patch Antennas

8. Power Backplanes

9. Remote Meter Readers

10. Wireless Telecommunications Systems

PCB Capability (RO3203)