(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

Rogers RO3203 High Frequency Circuit Materials are advanced ceramic-filled laminates reinforced with woven fiberglass, designed to deliver superior electrical performance and mechanical stability at cost-effective prices. With a dielectric constant of 3.02 and an ultra-low dissipation factor of 0.0016, Rogers RO3203 laminates support high-frequency applications exceeding 40 GHz.

RO3203 PCBs combines the smooth surface finish of non-woven PTFE laminates (enabling precise etching) with the structural rigidity of woven-glass PTFE laminates, making them compatible with standard PTFE PCB manufacturing processes. Available with 0.5, 1, or 2 oz/ft² (17, 35, 70 µm) electrodeposited copper cladding, these materials are produced under ISO 9002-certified quality control.

1. Woven glass reinforcement improves rigidity for easier handling.

2. Uniform electrical and mechanical performance is ideal for complex multilayer high frequency structures.

3. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz.

4. Excellent mechanical properties over a wide range of dielectric constants are ideal for multilayer board designs.

5. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs

and reliable surface mounted assemblies.

6. Excellent dimensional stability for high production yields.

7. Economically priced for volume manufacturing.

8. Surface smoothness allows for finer line etching tolerances

1. Automotive Collision Avoidance Systems

2. Automotive Global Positioning Satellite Antennas

3. Base Station Infrastructure

4. Datalink on Cable Systems

5. Direct Broadcast Satellites

6. LMDS and Wireless Broadband

7. Microstrip Patch Antennas

8. Power Backplanes

9. Remote Meter Readers

10. Wireless Telecommunications Systems

PCB Capability (RO3203)