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Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Immersion Gold PCB  

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

 
   

Rogers RO3006 high - frequency circuit materials, being ceramic - filled PTFE composites, are designed for commercial microwave and RF applications. They are engineered to deliver exceptional electrical and mechanical stability at a competitive cost. The mechanical properties are uniform, enabling designers to develop multi - layer board designs without encountering warping phenomena or reliability problems. In the X and Y directions, RO3006 materials have a coefficient of thermal expansion (CTE) of 17 ppm/℃. This CTE is equivalent to that of copper, which gives the material excellent dimensional stability. After etching and baking, the typical etch shrinkage is less than 0.5 mils per inch. The Z - axis CTE of 24 ppm/℃ ensures remarkable plated through - hole reliability, even in severe environmental conditions.

 
   
Typical applications:  

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers

 
   
PCB Specifications  

 

Rogers RO3006 10mil 0.254mm High Frequency PCB DK6.15 RF PCB Board for Global Positioning Satellite Antennas

 

 

PCB SIZE

152 x 152mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 18um(0.5 oz)+plate TOP layer

 

RO3006 0.254mm

 

copper ------- 18um(0.5 oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

14 mil / 14 mil

Minimum / Maximum Holes:

0.4 mm / 4.0 mm

Number of Different Holes:

1

Number of Drill Holes:

1

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RO3006 0.254mm

Final foil external:

1 oz

Final foil internal:

N/A

Final height of PCB:

0.3 mm ±0.1mm

PLATING AND COATING

 

Surface Finish

Immersion Gold

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

N/A

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.4mm.

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.

 
 
Rogers 3006 (RO3006) Data Sheet

RO3006 Typical Value

Property

RO3006

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

6.15±0.05

Z

 

10 GHz/23

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

6.5

Z

 

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.002

Z

 

10 GHz/23

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

-262

Z

ppm/

10 GHz -50to 150

IPC-TM-650 2.5.5.5

Dimensional Stability

0.27
0.15

X
Y

mm/m

COND A

IPC-TM-650 2.2.4

Volume Resistivity

105

 

MΩ.cm

COND A

IPC 2.5.17.1

Surface Resistivity

105

 

COND A

IPC 2.5.17.1

Tensile Modulus

1498
1293

X
Y

MPa

23

ASTM D 638

Moisture Absorption

0.02

 

%

D48/50

IPC-TM-650 2.6.2.1

Specific Heat

0.86

 

j/g/k

 

Calculated

Thermal Conductivity

0.79

 

W/M/K

50

ASTM D 5470

Coefficient of Thermal Expansion
(-55 to 288)

17
17
24

X
Y
Z

ppm/

23/50% RH

IPC-TM-650 2.4.4.1

Td

500

 

 TGA

 

ASTM D 3850

Density

2.6

 

gm/cm3

23

ASTM D 792

Copper Peel Stength

7.1

 

Ib/in.

1oz,EDC After Solder Float

IPC-TM 2.4.8

Flammability

V-0

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 

 
   
   
   
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