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Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Immersion Gold PCB |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers RO3006 high - frequency circuit materials, being ceramic - filled PTFE composites, are designed for commercial microwave and RF applications. They are engineered to deliver exceptional electrical and mechanical stability at a competitive cost. The mechanical properties are uniform, enabling designers to develop multi - layer board designs without encountering warping phenomena or reliability problems. In the X and Y directions, RO3006 materials have a coefficient of thermal expansion (CTE) of 17 ppm/℃. This CTE is equivalent to that of copper, which gives the material excellent dimensional stability. After etching and baking, the typical etch shrinkage is less than 0.5 mils per inch. The Z - axis CTE of 24 ppm/℃ ensures remarkable plated through - hole reliability, even in severe environmental conditions. |
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Typical applications: |
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1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers |
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PCB Specifications |
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Rogers RO3006 10mil 0.254mm High Frequency PCB DK6.15 RF PCB Board for Global Positioning Satellite Antennas |
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PCB SIZE |
152 x 152mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
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RO3006 0.254mm |
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copper ------- 18um(0.5 oz) + plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
14 mil / 14 mil |
Minimum / Maximum Holes: |
0.4 mm / 4.0 mm |
Number of Different Holes: |
1 |
Number of Drill Holes: |
1 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RO3006 0.254mm |
Final foil external: |
1 oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.3 mm ±0.1mm |
PLATING AND COATING |
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Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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新.PNG) |
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Rogers 3006 (RO3006) Data Sheet |
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RO3006 Typical Value |
Property |
RO3006 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
6.15±0.05 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
6.5 |
Z |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.002 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-262 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.27
0.15 |
X
Y |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Volume Resistivity |
105 |
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MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
105 |
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MΩ |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
1498
1293 |
X
Y |
MPa |
23℃ |
ASTM D 638 |
Moisture Absorption |
0.02 |
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% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.86 |
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j/g/k |
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Calculated |
Thermal Conductivity |
0.79 |
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W/M/K |
50℃ |
ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) |
17
17
24 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Td |
500 |
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℃ TGA |
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ASTM D 3850 |
Density |
2.6 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
7.1 |
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Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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