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Rogers RO3003 RF PCB 2-Layer Rogers 3003 60mil 1.524mm PCB with Low Dielectric Loss |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers RO3003 high-frequency circuit materials are ceramic-filled PTFE composites specifically designed for commercial microwave and RF applications. They provide exceptional electrical and mechanical stability at a competitive price point. The mechanical properties are consistent, allowing designers to develop multi-layer board designs without facing warpage or reliability challenges. The materials feature a coefficient of thermal expansion (CTE) of 17 ppm/°C in the X and Y axes, matching that of copper, which contributes to excellent dimensional stability. Typically, the etch shrinkage after etch and bake is less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/°C, providing remarkable reliability for plated through-holes, even in severe conditions. |
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Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers |
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PCB Specifications |
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Rogers RO3003 60mil 1.524mm High Frequency PCB DK3.0 RF PCB for Power Amplifiers and Antennas |
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PCB SIZE |
88 x 92mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RO3003 1.524mm |
copper ------- 18um(0.5 oz) + plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
5 mil / 5 mil |
Minimum / Maximum Holes: |
0.4 mm / 5.2 mm |
Number of Different Holes: |
7 |
Number of Drill Holes: |
95 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
3 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RO3003 1.524mm |
Final foil external: |
1oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.6 mm ±10% |
PLATING AND COATING |
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Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
NO |
Solder Mask Color: |
NO |
Solder Mask Type: |
NO |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
TOP |
Colour of Component Legend |
Black |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of Rogers 3003 (RO3003) |
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RO3003 Typical Value |
Property |
RO3003 |
Direction |
Units |
Condition |
Test Method |
Electrical Properties |
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Dielectric Constant,εProcess |
3.0±0.04 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3 |
Z |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.001 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-3 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
107 |
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MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
107 |
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MΩ |
COND A |
IPC 2.5.17.1 |
Thermal Properties |
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Td |
500 |
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℃ TGA |
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ASTM D 3850 |
Coefficient of Thermal Expansion
(-55 to 288℃) |
17
16
25 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Thermal Conductivity |
0.5 |
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W/M/K |
50℃ |
ASTM D 5470 |
Mechanical Properties |
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Copper Peel Stength |
12.7 |
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Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Young's Modulus |
930
823 |
X
Y |
MPa |
23℃ |
ASTM D 638 |
Dimensional Stability |
-0.06
0.07 |
X
Y |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Physical Properties |
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Flammability |
V-0 |
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UL 94 |
Moisture Absorption |
0.04 |
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% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Density |
2.1 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Specific Heat |
0.9 |
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j/g/k |
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Calculated |
Lead-free Process Compatible |
Yes |
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Hot Tags:
| 2 Layers RO3003 PCB |
2-Layer Low Dissipation PCB |
60mil RO3003 High Frequency PCB |
Rogers RO3003 RF Circuit Board |
Rogers RO3003 Substrate |
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