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Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold  
   
(As PCBs are custom - produced goods, the picture and parameters shown are only intended for reference.)  
   

Hello Everyone,

Today, we’re discussing RO3003 high-frequency PCBs. RO3003 high-frequency circuit laminates are ceramic-filled PTFE composites designed for commercial microwave and RF applications. A key characteristic of these laminates is their exceptional electrical performance, coupled with stable and consistent mechanical properties. This reliability enables our designers to create multi-layer board designs with confidence, avoiding issues like warpage and reliability concerns.

Now, let’s explore some additional features and applications.

 
   
 
   

1. Low Dielectric Loss: With a dielectric factor (DF) of 0.001, RO3003 is suitable for applications up to 77 GHz.

2. Stable Dielectric Constant: Its dielectric constant remains stable across temperature and frequency, making it an ideal material for band-pass filters, microstrip patch antennas, and voltage-controlled oscillators.

3. Excellent Mechanical Properties: The laminate offers reliable performance in stripline and multi-layer board constructions, even at varying temperatures.

4. Uniform Mechanical Properties: Its consistent mechanical properties make it suitable for use in epoxy-glass multi-layer board hybrid designs. Low In-Plane

5. Expansion Coefficient: Matching the expansion coefficient of copper, it ensures more reliable surface-mounted assemblies, making it ideal for applications sensitive to temperature changes and providing excellent dimensional stability.

 
 
Our PCB Capability (RO3003))  

PCB Material:

Ceramic-filled PTFE composite

Designator:

RO3003

Dielectric constant:

3.0  ±0.04 (process)

 

3.0 (design)

Layer count:

1 Layer, 2 Layer, Multilayer, Hybrid PCB

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 20mil (0.508mm)

 

30mil (0.762mm), 60mil (1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, OSP etc..

 

 

 
   

Rogers RO3003 high-frequency PCBs come in double-sided, multi-layer, and hybrid constructions. The copper thickness ranges from 0.5 oz to 2 oz, with board thicknesses available from 0.3 mm to 1.6 mm. The maximum dimensions are 400 mm by 500 mm, and surface finishes include bare copper, hot air leveling, immersion gold, and more.

 
   
 
   

Typical Applications

1. Automotive radar applications

2. GPS Antennas

3. Power amplifiers and antennas

4. Patch antennas for wireless communications

5. Direct broadcast satellite

 
   
 
   

The base color of RO3003 PCBs is white.

The manufacturing process for RO3003 high-frequency PCBs is similar to that of standard PTFE PCBs, making it well-suited for volume production and providing a competitive market advantage.

If you have any questions, please don’t hesitate to reach out.

Thank you for reading!

 
   

Appendix: RO3003 Data Sheet

 

 RO3003 Typical Value

Property

RO3003

Direction

Units

Condition

Test Method

Electrical Properties

 

 

 

 

 

Dielectric Constant,εProcess

3.0±0.04

Z

 

10 GHz/23

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3

Z

 

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.001

Z

 

10 GHz/23

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

-3

Z

ppm/

10 GHz -50to 150

IPC-TM-650 2.5.5.5

Volume Resistivity

107

 

MΩ.cm

COND A

IPC 2.5.17.1

Surface Resistivity

107

 

COND A

IPC 2.5.17.1

Thermal Properties

 

 

 

 

 

Td

500

 

 TGA

 

ASTM D 3850

Coefficient of Thermal Expansion
(-55 to 288)

17
16
25

X
Y
Z

ppm/

23/50% RH

IPC-TM-650 2.4.4.1

Thermal Conductivity

0.5

 

W/M/K

50

ASTM D 5470

Mechanical Properties

 

 

 

 

 

Copper Peel Stength

12.7

 

Ib/in.

1oz,EDC After Solder Float

IPC-TM 2.4.8

Young's Modulus

930
823

X
Y

MPa

23

ASTM D 638

Dimensional Stability

-0.06
0.07

X
Y

mm/m

COND A

IPC-TM-650 2.2.4

Physical Properties

 

 

 

 

 

Flammability

V-0

 

 

 

UL 94

Moisture Absorption

0.04

 

%

D48/50

IPC-TM-650 2.6.2.1

Density

2.1

 

gm/cm3

23

ASTM D 792

Specific Heat

0.9

 

j/g/k

 

Calculated

Lead-free Process Compatible

Yes

 

 

 

 

 

 

 
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