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Rogers Microwave PCB 20mil 0.508mm RO4003C Double Sided RF Printed Circuit Board |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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RO4003C hydrocarbon ceramic laminates are engineered to provide exceptional high-frequency performance while keeping circuit fabrication costs low. As operational frequencies climb to 500 MHz and beyond, the options available to designers for laminates drastically narrow down.
RO4003C material boasts the essential qualities required by RF microwave circuit designers, matching networks, and controlled impedance transmission lines. Its low dielectric loss enables it to be utilized in numerous applications where conventional circuit board materials fall short due to higher operating frequencies.
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RO4003C material boasts an exceptionally low temperature coefficient of the dielectric constant, maintaining stability across a broad frequency spectrum. Its thermal coefficient of expansion (CTE) is advantageous for PCB designers due to its similarity to copper's CTE, enabling superior dimensional stability essential for complex multi-layer board designs with mixed dielectrics.
What's more, RO4003C's low CTE in the Z-axis guarantees reliable plated through-hole performance, even under severe thermal stress. The material's high Tg (glass transition temperature) of over 280°C ensures its expansion properties remain consistent throughout the PCB manufacturing process. |
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RO4003C PCB Specifications |
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Rogers 20mil 0.508mm RO4003C High Frequency PCB Double Sided RF PCB Repeater PA |
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PCB SIZE |
67 x 72mm=1up |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 35um(1 oz)+plate TOP layer |
RO4003C 0.508mm |
copper ------- 35um(1oz) + plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
7.9 mil / 5.9 mil |
Minimum / Maximum Holes: |
0.4 mm / 0.4 mm |
Number of Different Holes: |
1 |
Number of Drill Holes: |
3 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RO4003C Tg280℃, er<3.48, Rogers Corp. |
Final foil external: |
1.5 oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.6 mm ±0.1 |
PLATING AND COATING |
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Surface Finish |
Immersion gold, 37% |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING |
N/A |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Typical applications: |
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Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID |
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Data sheet of Rogers 4003C (RO4003C) |
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RO4003C Typical Value |
Property |
RO4003C |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.38±0.05 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3.55 |
Z |
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8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factortan,δ |
0.0027
0.0021 |
Z |
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10 GHz/23℃
2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+40 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.7 x 1010 |
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MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
4.2 x 109 |
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MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
19,650(2,850)
19,450(2,821) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Tensile Strength |
139(20.2)
100(14.5) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Flexural Strength |
276
(40) |
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MPa
(kpsi) |
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IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.3 |
X,Y |
mm/m
(mil/inch) |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
11
14
46 |
X
Y
Z |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
Tg |
>280 |
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℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
425 |
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℃ TGA |
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ASTM D 3850 |
Thermal Conductivity |
0.71 |
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W/M/oK |
80℃ |
ASTM C518 |
Moisture Absorption |
0.06 |
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% |
48hrs immersion 0.060"
sample Temperature 50℃ |
ASTM D 570 |
Density |
1.79 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
1.05
(6.0) |
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N/mm
(pli) |
after solder float 1 oz.
EDC Foil |
IPC-TM-650 2.4.8 |
Flammability |
N/A |
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UL 94 |
Lead-free Process Compatible |
Yes |
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Hot Tags:
| Rogers R04003C PCB Supplier |
20 mil R04003C High Frequency substrate |
0.508mm RF Printed Circuit Board |
R04003C Data Sheet |
Rogers R04003C Dielectric Constant |
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