| |
|
|
|
|
|
|
|
|
Rogers Kappa 438 PCB 20mil 0.508mm High-Frequency Printed Circuit Board DK4.38 PCB with UL94 V-0 |
|
|
(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
|
|
|
|
|
Brief Introduction |
|
|
Rogers Kappa 438 PCBs are engineered with a glass-reinforced hydrocarbon-ceramic system, delivering exceptional high-frequency performance (Dk 4.38, Df 0.0032 at 10 GHz) while enabling cost-effective circuit fabrication. Unlike traditional PTFE materials, Kappa 438 PCB is fully compatible with standard FR-4 manufacturing processes, including mechanical drilling, epoxy-based lamination, and conventional soldering, eliminating the need for specialized equipment.
This low-loss Kappa 438 PCB material features a UL 94 V-0 flame retardant rating and seamless compatibility with lead-free solder processes (up to 260°C), ensuring compliance with modern industry standards. Its glass-weave reinforcement provides superior dimensional stability (Z-axis CTE: 17 ppm/°C), minimizing drill registration errors and etch shrinkage during production. |
|
|
|
|
|
Features |
|
|
1. Glass reinforced hydrocarbon thermoset platform
2. Dk of 4.38 is tailored to FR-4 industry standard norms
3. Tighter Dk and thickness tolerance than FR-4
4. Low Z Axis CTE of 42 ppm/°C
5. High Tg of > 280°C TMA
6. Meets UL 94-V0 requirements |
|
|
|
|
|
Benefits |
|
|
1. Ease of PCB manufacturing and assembly in Line with FR-4
2. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance
3. Consistent circuit performance
4. Improved design flexibility and plated through-hole reliability
5. Automated assembly compatible |
|
|
|
|
|
 |
|
|
|
|
|
Typical Applications: |
|
|
1. Carrier Grade WiFi/Licensed Assisted Access (LAA)
2. Small Cell and Distributed Antenna Systems (DAS)
3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)
4. Internet of Things (IoT)
Segments: Smart Home and Wireless Meters |
|
|
|
|
|
 |
|
|
|
|
|
 |
|
|
|
|
|
Our PCB Capability (Kappa 438) |
|
|
PCB Capability (Kappa 438) |
PCB Material: |
Glass Reinforced Hydrocarbon Ceramic |
Designation: |
Kappa 438 |
Dielectric constant: |
4.38 at 2.5GHz |
Layer count: |
Single Layer, Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35 µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersoin silver, Immersion tin, OSP, ENEPIG, Pure gold etc.. |
|
|
|
|
|
|
Data Sheet of Kappa 438 Laminate |
|
|
Property |
Typical Value Kappa 438 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant, er Design |
4.38 |
Z |
- |
2.5 GHz |
Differential Phase Length Method |
Dissipation Factor tan, d |
0.005 |
Z |
- |
10 GHz/23°C |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of Dielectric Constant e |
-21 |
- |
ppm/°C |
10 GHz (-50 to 150°C) |
Modified IPC-TM-650 2.5.5.5 |
Volume Resistivity |
2.9 x 109 |
- |
MΩ•cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
6.2 x 107 |
- |
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
675 |
Z |
V/mil |
- |
IPC-TM-650 2.5.6.2 |
Tensile Strength |
16 12 |
MD CMD |
kpsi |
- |
ASTM D3039/D3039-14 |
Flexural Strength |
25 19 |
MD CMD |
kpsi |
- |
IPC-TM-650 2.4.4 |
Dimensional Stability |
-0.48-0.59 |
MD CMD |
mm/m |
- |
IPC-TM-650 2.4.39a |
Coefficient of Thermal Expansion |
13 |
X |
ppm/°C |
-55 to 288°C |
IPC-TM-650 2.4.41 |
16 |
Y |
42 |
Z |
Thermal Conductivity |
0.64 |
Z |
W/(m.K) |
80°C |
ASTM D5470 |
Time to Delamination (T288) |
>60 |
- |
minutes |
288°C |
IPC-TM-650 2.4.24.1 |
Tg |
>280 |
- |
°C TMA |
- |
IPC-TM-650 2.4.24.3 |
Td |
414 |
- |
°C |
- |
IPC-TM-650 2.3.40 |
Moisture Absorption |
0.07 |
- |
% |
24/23 |
IPC-TM-650 2.6.2.1 |
Young’s Modulus |
2264 2098 |
MD CMD |
kpsi |
- |
ASTM D3039/D3039-14 |
Flex Modulus |
2337 2123 |
MD CMD |
kpsi |
- |
IPC-TM-650 2.4.4 |
Bow |
0.03 |
- |
% |
- |
IPC-TM-650 2.4.22C |
Twist |
0.08 |
- |
% |
- |
IPC-TM-650 2.4.22C |
Copper Peel Strength After Thermal Stress |
5.8 |
- |
lbs/in |
1 oz (35 µm) foil |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
- |
- |
- |
UL 94 |
Specific Gravity |
1.99 |
- |
g/cm3 |
- |
ASTM D792 |
Lead-Free Process Compatible |
Yes |
- |
- |
- |
|
|
|
|
|
|
|
|
|
|
Hot Tags:
High Temperature PCB |
Kappa 438 High Frequency PCB |
Rogers Kappa 438 PCB Material |
Kappa 438 Printed Circuit Board |
High TG PCB Material |
|
|
|
