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Rogers-6006-PCB-Available-in-25mil, 50mil, and-75mil-with-Immersion-Gold-and-Green-Mask-for-Ground-Radar-Warning |
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(As PCBs are custom - produced goods, the picture and parameters shown are only intended for reference.) |
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Hi Guys,
Today, let’s dive into the world of Rogers 6006 PCB.
Rogers RT/duroid 6006 microwave laminates are advanced ceramic-PTFE composites, specifically engineered for high-performance electronic and microwave circuits that demand a high dielectric constant. With a dielectric constant (Dk) of 6.15, this material is ideal for applications requiring precise signal control and stability in demanding RF and microwave environments. |
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PCB Capability (RT/duroid 6006) |
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PCB Material: |
Ceramic-PTFE composite |
Designator: |
RT/duroid 6006 |
Dielectric constant: |
6.15 ±0.15 (process) |
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6.45 (design) |
Layer count: |
1 Layer, 2 Layer |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 25mil (0.635mm) |
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50mil (1.27mm), 75mil (1.90mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion Tin, Immersion Silver and OSP. |
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The RT/duroid 6006 microwave laminates offer excellent fabrication ease and operational stability, making them ideal for large-scale production and cost-effective manufacturing. Their tight dielectric constant and thickness tolerances, combined with low moisture absorption and strong thermal-mechanical stability, ensure consistent quality and performance. |
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Features and Benefits |
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1. High dielectric constant for circuit size reduction |
2. Low loss. Ideal for operating at X-bank or below |
3. Tight DK and thickness control for repeatable circuit performance |
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Typical Applications |
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It is widely used in aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc. |
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Appendix: Properties of RT/duroid 6006 laminates |
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RT/duroid 6006 Typical Value |
Property |
RT/duroid 6006 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
6.15±0.15 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped stripline |
Dielectric Constant,εDesign |
6.45 |
Z |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0027 |
Z |
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10 GHz/A |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-410 |
Z |
ppm/℃ |
-50℃-170℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
7 x 107 |
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Mohm.cm |
A |
IPC 2.5.17.1 |
Surface Resistivity |
2 x 107 |
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Mohm |
A |
IPC 2.5.17.1 |
Tensile Properties |
ASTM D638 (0.1/min. strain rate) |
Young's Modulus |
627(91) 517(75) |
X Y |
MPa(kpsi) |
A |
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Ultimate Stress |
20(2.8) 17(2.5) |
X Y |
MPa(kpsi) |
A |
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Ultimate Strain |
12 to 13 4 to 6 |
X Y |
% |
A |
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Compressive Properties |
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ASTM D695 (0.05/min. strain rate) |
Young's Modulus |
1069 (115) |
Z |
MPa(kpsi) |
A |
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Ultimate Stress |
54(7.9) |
Z |
MPa(kpsi) |
A |
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Ultimate Strain |
33 |
Z |
% |
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Flexural Modulus |
2634 (382) 1951 (283) |
X |
MPa(kpsi) |
A |
ASTM D790 |
Ultimate Stress |
38 (5.5) |
X Y |
MPa(kpsi) |
A |
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Deformation under load |
0.33 2.1 |
Z Z |
% |
24hr/50℃/7MPa 24hr/150℃/7MPa |
ASTM D261 |
Moisture Absorption |
0.05 |
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% |
D48/50℃ 0.050"(1.27mm) thick |
IPC-TM-650 2.6.2.1 |
Thermal Conductivity |
0.49 |
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W/m/k |
80℃ |
ASTM C518 |
Coefficient of Thermal Expansion |
47
34
117 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.41 |
Td |
500 |
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℃ TGA |
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ASTM D3850 |
Density |
2.7 |
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g/cm3 |
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ASTM D792 |
Specific Heat |
0.97(0.231) |
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j/g/k
(BTU/ib/OF) |
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Calculated |
Copper Peel |
14.3 (2.5) |
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pli (N/mm) |
after solder float |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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Thank you for your reading. |
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Hot Tags:
RT/Duroid 6006 Material |
25 Mil 50 Mil RT/Duroid 6006 Material |
Rogers RT/Duroid 6006 PCB |
75 Mil RT/Duroid 6006 Laminate |
Rogers RT/Duroid 6006 PCB Substrate |
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