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RT/duroid 5880LZ High Frequency PCB |
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Rogers RT/duroid 5880LZ laminates are unique PTFE composites, which are designed for exacting stripline and microstrip circuit applications. The unique filler results in a low density, lightweight material for high performance and weight sensitive applications.The very low dielectric constant is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness to Ku-band and above. |
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Features:
1. Lowest dielectric constant of 2.00 +/- 0.04
2. Low dissipation factor ranging from .0021 to .0027 at 10GHz
3. Low Z-axis coefficient of thermal expansion at 40 ppm/°C
4. Lightweight / low density of 1.4 gm/cm sq.
5. Uniform electrical properties over a wide frequency range
6. Resistant to all solvents and reagents, hot or cold, normally used in etching or plating |
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Some Typical Applications:
1. Airborne antenna system
2. Lightweight feed networks
3. Military radar systems
4. Missile guidance systems
5. Point-to-point digital radio antenna
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Our PCB Capability (RT/duroid 5880LZ)
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| PCB Material: |
Unique PTFE Composites |
| Designation: |
RT/Duroid 5880LZ |
| Dielectric constant: |
2 |
| Dissipation Factor |
0.0021 10GHz |
| Layer count: |
Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: |
0.5oz (17 μm), 1oz (35μm) |
| Laminate thickness: |
10mil (0.254mm), 20mil (0.508mm), 50mil (1.270mm), 100mil (2.540mm ) |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
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Typical Value of RT/duroid 5880LZ |
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| Property |
Typical Value RT/duroid? 5880LZ |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant er,Process |
2.00 ± 0.04 |
Z |
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10 GHz/23°C |
IPC-TM-650, 2.5.5.5 |
| Dielectric Constant er,Design |
2.00 |
Z |
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8 GHz - 40 GHz |
Differential Phase Length Method |
| Dissipation Factor, tan? |
Typ: 0.0021 Max: 0.0027 |
Z |
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10GHz/23°C |
IPC-TM-650, 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant, er |
+20 |
Z |
ppm/°C |
-50°C to 150°C 10GHz |
IPC-TM-650, 2.5.5.5 |
| Volume Resistivity |
1.74 X 10^7 |
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Mohm?cm |
C-96/35/90 |
IPC-TM-650, 2.5.17.1 |
| Surface Resistivity |
2.08 X 10^6 |
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Mohm |
C-96/35/90 |
IPC-TM-650, 2.5.17.1 |
| Electrical Strength |
40 |
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KV |
D48/50 |
IPC-TM-650, 2.5.6 |
| Dimensional Stability |
-0.38 |
X,Y |
% |
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IPC-TM-650, 2.4.39A |
| Moisture Absorption |
0.31 |
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% |
24 hours/23°C |
IPC-TM-650, 2.6.2.1 |
| Thermal Conductivity |
0.33 |
Z |
W/m/°K |
80°C |
ASTM C518 |
| Coefficient of Thermal Expansion |
54, 47 40 |
X,Y Z |
ppm/°C |
0 to 150°C? |
IPC-TM-650, 2.4.41 |
| Outgassing |
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| TML |
0.01 |
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% |
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ASTM E-595 |
| CVCM |
0.01 |
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| WVR |
0.01 |
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| Density |
1.4 |
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gm/cm^3 |
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ASTM D792 |
| Copper Peel |
>4.0 |
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pli |
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IPC-TM-650, 2.4.8 |
| Flammability |
V-O |
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UL 94 |
| Lead-Free Process Compatible |
YES |
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