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RT/Duroid 5880 10mil 0.254mm Rogers High Frequency PCB for Microstrip and Stripline Circuits  

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

  
   

Rogers RT/duroid 5880, a high - frequency wonder, is a glass microfiber reinforced PTFE composite engineered specifically for precision stripline and microstrip circuit applications. Its randomly oriented microfibers endow it with exceptional dielectric constant uniformity. Across different panels, the dielectric constant remains consistent, and it stays constant over a broad frequency range. With an impressively low dissipation factor, RT/duroid 5880 extends its usability well into the Ku - band and beyond. This material is also highly workable; it can be easily cut, sheared, and machined into any desired shape. Moreover, it resists all solvents and reagents, whether hot or cold, commonly used in etching printed circuits or plating edges and holes.

RT/duroid 5880 PCB finds its place in a plethora of applications such as commercial airline broadband antennas, microstrip and stripline circuits, millimeter - wave applications, military radar systems, missile guidance systems, and point - to - point digital radio antennas.

  
   
 
   
PCB Specifications  

 

Rogers RT/Duroid 5880 10mil 0.254mm High Frequency PCB for Microstrip and Stripline Circuits

 

 

PCB SIZE

130 x 100mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 18um(0.5 oz)+plate TOP layer

RT/duroid 5880 0.254mm

copper ------- 18um(0.5oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

5 mil / 4 mil

Minimum / Maximum Holes:

0.2 mm / 0.2mm

Number of Different Holes:

1

Number of Drill Holes:

15

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RT/duroid 5880 0.254mm

Final foil external:

1.0 oz

Final foil internal:

N/A

Final height of PCB:

0.3 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion gold

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

N/A

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.22mm. Via tented.

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.

 

 
 
Data Sheet of Rogers RT/duroid 5880

RT/duroid 5880 Typical Value

Property

RT/duroid 5880

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.20
2.20±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.2

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0004
0.0009

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-125

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 107

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

3 x 107

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23）

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23℃

Test at 100℃

N/A

MPa(kpsi)

A

ASTM D 638

1070(156)

450(65)

X

860(125)

380(55)

Y

Ultimate Stress

29(4.2)

20(2.9)

X

27(3.9）

18(2.6)

Y

Ultimate Strain

6

7.2

X

%

4.9

5.8

Y

Compressive Modulus

710(103)

500(73)

X

MPa(kpsi)

A

ASTM D 695

710(103)

500(73)

Y

940(136)

670(97)

Z

Ultimate Stress

27(3.9)

22(3.2)

X

29(5.3)

21(3.1)

Y

52(7.5)

43(6.3)

Z

Ultimate Strain

8.5

8.4

X

%

7.7

7.8

Y

12.5

17.6

Z

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.2

Z

W/m/k

80℃

ASTM C 518

Coefficient of Thermal Expansion

31
48
237

X
Y
Z

ppm/℃

0-100℃

IPC-TM-650 2.4.41

Td

500

N/A

℃ TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm3

N/A

ASTM D 792

Copper Peel

31.2(5.5)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A

 

  
   
   
   
   
   
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