Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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RO4835 PCB High Frequency PCB

Rogers RO4835 substrates are hydrocarbon ceramic laminates, a type of antioxidative high frequency materials for applications demanding greater stability at elevated temperatures. It is significantly more resistant to oxidation than other hydrocarbon based materials. RO4835 laminates are designed to offer superior high frequency performance and low cost circuit fabrication. Moreover, RO4835 material provides nearly identical electrical and mechanical properties to RO4350B laminates, which customers have used successfully for many years.

 

Oxidation affects all thermoset laminate materials over time and temperature. In the long term, oxidation can lead to small increases in dielectric constant and dissipation factor of the circuit substrate.

 

Features and Benefits
1. Significantly improved oxidation resistance compared to typical thermoset microwave materials, which are designed for performance sensitive, high volume applications.
2. Low loss exhibits excellent electrical performance allowing application with higher operating frequencies, especially ideal for automotive applications.
3. Tight dielectric constant tolerance results in controlled impedance transmission lines
4. Lead-free process compatible results in no blistering or delamination
5. Low Z-axis expansion results in reliable plated through holes
6. Low in-plane expansion coefficient remains stable over an entire range of circuit processing temperatures
7. CAF resistant

 

 
 
 

Our PCB Capability (RO4835)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4835
Dielectric constant: 3.48 (10 GHz)
Dissipation Factor 0.0037 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 μm), 1oz (35μm), 2oz (70μm)
Dielectric thickness (ED copper) 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm),? 60mil (1.524mm)
Dielectric thickness (LoPro copper) 4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..
 

Typical Applications:
1. Automotive Radar and Sensors
2. Point-to point Microwave
3. Power Amplifiers
4. Phased - Array Radar
5. RF Components

Appendix: Typical Values of RO4835

Property RO4835 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z - 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -100℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 5 x 10^8   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 7 x10^8   COND A IPC-TM-650 2.5.17.1
Electrical Strength 30.2(755) Z Kv/mm(v/mil)   IPC-TM-650 2.5.6.2
Tensile Modulus 7780(1128) Y MPa(ksi) RT ASTM D 638
Tensile Strength 136(19.7) Y MPa(ksi) RT ASTM D 638
Flexural Strength 186 (27)   Mpa (kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mils/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
31
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 390   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.66   W/m/oK 80℃ ASTM C518
Moisture Absorption 0.05   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.92   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88 (5.0)   N/mm (pli) after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

 

 

 

 

 
 
 
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