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RO4360G2 High Frequency PCB Based on 6-layer with 8mil Core Coating Immersion Gold for Small Cell Transceivers From Rogers  

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

 
   

Rogers RO4360G2 PCBs are low-loss, high-performance materials with a dielectric constant (Dk) of 6.15. These thermoset materials, reinforced with glass and filled with hydrocarbon ceramic, provide an ideal blend of performance and processing ease. RO4360G2 laminates are lead-free compatible and offer improved rigidity, enhancing manufacturability in multi-layer board designs while reducing costs.

 

Processing similarly to FR-4, RO4360G2 substrates are compatible with automated assembly and feature a low Z-axis CTE for design flexibility. They share the high Tg of the RO4000 series and can be combined with RO4450F prepreg and lower-Dk RO4000 laminates in multi-layer designs.

 

With a Dk of 6.15 (Design Dk 6.4), RO4360G2 PCBs allow for compact circuit designs, making them ideal for size- and cost-sensitive applications. They are a cost-effective solution for power amplifiers, patch antennas, ground-based radar, and various RF applications, offering outstanding performance and value.

 
   
Features and benefits:  

1. Advanced Thermoset Resin System for Dk 6.15 :

 

1). Easy fabrication with processing similar to FR-4.

 

2). Consistent material performance across batches.

 

3). Low dielectric loss for superior signal integrity.

 

4). High thermal conductivity for efficient heat dissipation.

 

5). Cost-effective solution compared to competing PTFE-based products.

 

 

2. Low Z-Axis CTE and High Tg:

 

1). Enhanced design flexibility.

 

2). Reliable plated through-hole performance.

 

3). Compatible with automated assembly processes.

 

 

3. Environmentally Friendly:

 

1). Lead free process compatible.

 

 

4. Regional Finished Goods Inventory:

 

1). Short lead times and fast inventory turnover.

 

2). Efficient supply chain management for timely delivery.

 
   
Some Typical Applications:  

1. Base Station Power Amplifiers

2. Small Cell Transceivers

3. Patch antennas

4. Ground-based Radar

 
   
 
   
RO4360G2 PCB Capability  

PCB Capability (RO4360G2)

PCB Material:

Hydrocarbon Ceramic-filled Thermoset Materials

Designation:

RO4360G2

Dielectric constant:

6.15 ±0.15

Layer count:

Double Layer, Multilayer, Hybrid PCB

Copper weight:

1oz (35µm), 2oz (70µm)

PCB thickness:

8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)

 

 

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold  etc..

 
   
RO4360G2 Stack up  
 
   
Data Sheet of RO4360G2  

RO4360G2 Typical Value

Property

RO4360G2

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

6.15±0.15

Z

 

10 GHz/23

IPC-TM-650 2.5.5.5

 

 

 

 

2.5 GHz/23

 

Dissipation Factor,tanδ

0.0038

Z

 

10 GHz/23

IPC-TM-650 2.5.5.5

Thermal Conductivity

0.75

 

W/mK

50

ASTM D-5470

Volume Resistivity

4.0 X 1013

 

Ω.cm

Elevated T

IPC-TM-650  2.5.17.1

Surface Resistivity

9.0 X 1012

 

Ω

Elevated T

IPC-TM-650  2.5.17.1

Electrical Strength

784

Z

V/mil

 

IPC-TM-650  2.5.6.2

Tensile Strength

131 (19)     97(14)

X                 Y

MPa (kpsi)

40 hrs 50%RH/23

ASTM D638

Flexural Strength

213(31)     145(21)

X                 Y

Mpa (kpsi)

40 hrs 50%RH/23

IPC-TM-650, 2.4.4

Coefficient of Thermal Expansion

13                     14                              28

X                      Y                         Z

ppm/

-50 to 288  After Replicated Heat Cycle

IPC-TM-650, 2.1.41

Tg

>280

 

℃ TMA

 

IPC-TM-650 2.4.24.3

Td

407

 

 

ASTM D3850 using TGA

T288

>30

Z

min

30 min / 125 Prebake

IPC-TM-650 2.2.24.1

Moisure Absorption

0.08

 

%

50/48hr

IPC-TM-650 2.6.2.1 ASTM D570

Thermal Coefficient of er

-131 @10 GHz

Z

ppm/℃

-50 to 150  

IPC-TM-650, 2.5.5.5

Density

2.16

 

gm/cm3

RT

ASTM D792

Copper Peel Stength

5.2 (0.91)

 

pli (N/mm)

Condtion B

IPC-TM-650 2.4.8

Flammability

V-0

 

 

 

UL 94 File QMTS2. E102765

 
   
   
   
Hot Tags:

8 Mil RO4360G2 PCB Thickness

RO4360G2 Laminate for Sale

RO4360G2 Dielectric Constant 6.15

Rogers RO4360G2 Material

6-layer RO4360G2 RF PCB

 

 

 

 

 
   
 
                                     
       
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