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RO4003C-LoPro-High-Frequency-PCB-16.7mil-Low-Profile-Copper-for-Routers-and-Servers-From-Rogers |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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A proprietary Rogers' technology is employed in RO4003C LoPro laminates. This technology makes it possible for the reverse - treated foil to bond with the standard RO4003C dielectric. The outcome is a laminate with reduced conductor loss, leading to better insertion loss and signal integrity. Meanwhile, it keeps all the other desirable features of the standard RO4003C PCB system. |
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Features/Benefits: |
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RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.
1. Lower insertion loss
2. Low PIM
3. Increased signal integrity
4. High circuit density
Low Z-axis coefficient of thermal expansion
1. Multi-layer board capability
2. Design flexibility
Lead-free process compatible
1. High temperature processing
2. Meets environmental concerns
CAF resistant |
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PCB Capability (RO4003C LoPro) |
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Our PCB Capability (RO4003C LoPro) |
PCB Material: |
Hydrocarbon Ceramic Laminates |
Designation: |
RO4003C LoPro |
Dielectric constant: |
3.38±0.05 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
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Typical applications: |
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1.Digital applications such as servers, routers, and high speed back planes
2.Cellular base station antennas and power amplifiers
3.LNB’s for direct broadcast satellites
4.RF Identification Tags |
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Typical Properties of RO4003C LoPro |
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RO4003C LoPro |
Property |
Typical Value |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant, Process |
3.38 ± 0.05 |
z |
-- |
10 GHz/23°C |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant, Design |
3.5 |
z |
-- |
8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factor tan, d |
0.0027 0.0021 |
z |
-- |
10 GHz/23°C 2.5 GHz/23°C |
IPC-TM-650 2.5.5.5 |
Thermal Coeffifi cient of er |
40 |
z |
ppm/°C |
-50°C to 150°C |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.7 X 1010 |
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MΩ•cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
4.2 X 109 |
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MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
z |
KV/mm(V/mil) |
0.51mm(0.020”) |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
26889(3900) |
Y |
MPa(kpsi) |
RT |
ASTM D638 |
Tensile Strength |
141(20.4) |
Y |
MPa(kpsi) |
RT |
ASTM D638 |
Flexural Strength |
276(40) |
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MPa(kpsi) |
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IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.3 |
X,Y |
mm/m(mils/inch) |
after etch +E2/150°C |
IPC-TM-650 2.4.39A |
Coeffifi cient of Thermal Expansion |
11 |
x |
ppm/°C |
-55 to 288°C |
IPC-TM-650 2.1.41 |
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14 |
y |
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46 |
z |
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Tg |
>280 |
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°C TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
425 |
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°C TGA |
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ASTM D3850 |
Thermal Conductivity |
0.64 |
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W/m/°K |
80°C |
ASTM C518 |
Moisture Absorption |
0.06 |
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% |
48 hrs immersion 0.060” sample Temperature 50°C |
ASTM D570 |
Density |
1.79 |
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gm/cm3 |
23°C |
ASTM D792 |
Copper Peel Strength |
1.05(6.0) |
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N/mm(pli) |
after solder float 1 oz. TC Foil |
IPC-TM-650 2.4.8 |
Flammability |
N/A |
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UL 94 |
Lead-Free Process Compatible |
Yes |
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Hot Tags:
RO4003C LoPro PCB Substrates |
RO4003C LoPro High Frequency PCB |
Rogers RO4003C LoPro PCB |
RO4003C LoPro PCB Material |
RO4003C LoPro Printed Circuit Board |
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