Brief Introduction
TB-73 high-temperature resistant and high-frequency Polyimide copper-clad laminates are designed to withstand high temperatures and high frequencies. They are used in the manufacture of special high-temperature and high-frequency circuit boards for electronic equipment in demanding industries such as aerospace, aviation, military, and underground petroleum exploration, among others. The material has excellent high-frequency dielectric properties, high-temperature resistance, and radiation resistance. Its nominal thickness ranges from 0.1mm to 10mm

Chemical Test Report
TB-73 meets the technical conditions outlined in the Q/XA50089-2004 standard. The material has undergone a series of tests to ensure its quality and performance.

The peel strength of TB-73 after thermal stress is ≥1.0 N/mm, and the actual test result is 1.42 N/mm, which is a pass. Similarly, the peel strength at 170℃ is ≥0.7 N/mm, and the actual test result is a pass as well.

The volume resistivity is ≥5×10^6 MΩ·cm according to the C-96/35/90 standard, and it achieved a test result of 6.6×10^7 MΩ·cm, which is a pass. According to the E-24/204 standard, the volume resistivity is also ≥5×10^6 MΩ·cm, and the actual test result is 6.2×10^8 MΩ·cm, which is also a pass.

The surface resistivity is also within the specified range. The actual test result for the C-96/35/90 standard is 3.4×10^7 MΩ, and for the E-24/204 standard, it is 2.3×10^8 MΩ, both of which are a pass.

TB-73 has a low moisture absorption rate of ≤0.35%, and the actual test result is 0.11%, which is a pass. The breakdown voltage is also satisfactory, with a test result of 44.3 kV, which is higher than the minimum requirement of 40 kV.

The dielectric constant at 1MHz is ≤4.5, and the actual test result is 4.12, which is a pass. Similarly, the dissipation factor at 1MHz is ≤0.01, and the actual test result is 0.0072, which is a pass as well.

Our PCB Capability (TB-73 Polyimide RF PCB)