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Panasonic Megtron 6 (M6) High Speed PCB |
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Megtron 6 is an ultra-low loss, highly heat resistant circuit board material designed for mobile, networking, and wireless applications etc. The main properties of Megtron 6 are low dielectric constant (DK) and dielectric dissipation factors (DF), low transmission loss and high heat resistance. |
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Part Numbers
Low Dielectric Constant (Dk) Glass Cloth - Laminate R-5775(N) / PrepregR-5670(N)
Standard E Glass Cloth - Laminate R-5775 / PrepregR-5670 |
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Main Features
Low Dk = 3.7 (@ 1GHz), Low Df = 0.002 (@ 1GHz)
Excellent through-hole reliability (5x better than our conventional high Tg FR4 material)
Lead-free, ROHS-compliant soldering
High heat resistance
M6 also provides excellent high-density interconnect (HDI) and thermal performance. |
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Main Applications
Antenna (Automotive millimeter wave radar, Base station)
ICT infrastructure equipment
Measuring instrument
Super computer |
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Our PCB Capabilities (Megtron 6) |
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PCB Material: |
Low DK Glass Cloth |
Designation: |
Laminate R-5775(G), Prepreg R-5670(G) |
Dielectric constant: |
3.61 at 10GHz |
Dissipation Factor |
0.004 at 10GHz |
Layer count: |
Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
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Typical Value of R-5775 |
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Property |
Units |
Test Method |
Condition |
Typical Value |
THERMAL |
Glass Transition Temp ( Tg ) |
C |
DSC |
As received |
185 |
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DMA |
As received |
210 |
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Thermal Decomposition Temp |
C |
TGA |
As received |
410 |
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Time to Delam (T288) |
Without Cu |
Min |
IPC TM-650 2.4.24.1 |
As received |
> 120 |
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With Cu |
Min |
IPC TM-650 2.4.24.1 |
As received |
> 120 |
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CTE : α1 |
X - axis ppm / C |
ppm / C |
IPC TM-650 2.4.24 |
< Tg |
14 - 16 |
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Y - axis ppm / C |
ppm / C |
IPC TM-650 2.4.24 |
< Tg |
14 - 16 |
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Z - axis ppm / C |
ppm / C |
IPC TM-650 2.4.24 |
< Tg |
45 |
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CTE : α2 |
Z - axis ppm / C |
ppm / C |
IPC TM-650 2.4.24 |
> Tg 260 |
260 |
ELECTRICAL |
Volume Resistivity |
MΩ - cm |
IPC TM-650 2.5.17.1 |
C-96/35/90 |
1 x 10^9 |
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Surface Resistivity |
MΩ |
IPC TM-650 2.5.17.1 |
C-96/35/90 |
1 x 10^8 |
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Dielectric Constant ( Dk ) |
@ 1GHz |
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IPC TM-650 2.5.5.9 |
C-24/23/50 |
3.71 |
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@ 10GHz |
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IPC TM-650 2.5.5.5 |
C-24/23/50 |
3.61 |
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Dissipation Factor ( Df ) |
@ 1GHz |
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IPC TM-650 2.5.5.9 |
C-24/23/50 |
0.002 |
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@ 10GHz |
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IPC TM-650 2.5.5.5 |
C-24/23/50 |
0.004 |
PHYSICAL |
Water Absorption |
% |
IPC TM-650 2.6.2.1 |
D-24/23 |
0.14 |
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Peel Strength |
1oz ( H-VLP ) |
kN / m |
IPC TM-650 2.4.8 |
As Received 0.8 |
0.8 |
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Flammability |
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UL |
C-48/23/50 |
94V-0 |
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Megtron 6 Material List in stock (as of January 2022) |
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Item |
Thickness (mil) |
Thickness(mm) |
Structure |
Copper weight(oz) |
Type of copper |
R5775G |
2.0 |
0.050 |
1035*1 |
H/H |
HVLP |
R5775G |
2.6 |
0.065 |
1080*1 |
H/H |
HVLP |
R5775G |
3.0 |
0.075 |
1078*1 |
1.0/1.0 |
RTF |
R5775G |
3.0 |
0.075 |
1078*1 |
H/H |
RTF |
R5775G |
3.0 |
0.075 |
1078*1 |
1.0/1.0 |
HVLP |
R5775G |
3.0 |
0.075 |
1078*1 |
H/H |
HVLP |
R5775G |
3.9 |
0.100 |
3313*1 |
H/H |
RTF |
R5775G |
3.9 |
0.100 |
3313*1 |
1.0/1.0 |
RTF |
R5775G |
5.9 |
0.150 |
1080*2 |
2.0/2.0 |
RTF |
R5775G |
9.8 |
0.250 |
2116*2 |
H/H |
RTF |
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