|
|
|
|
|
|
|
PI-Stiffener-Flexible-PCB(FPC)--0.15mm-Flexible-Circuit-Board-with-Shengyi-Laminate-for-Wireless-Dongle-Applications |
|
|
(FPC’s are custom-made products. The picture and parameters shown are for reference only.) |
|
|
|
|
|
General description of PI Stiffener Flexible PCB |
|
|
This 0.2mm thick single-layer FPC utilizes Shengyi base PI-Stiffener laminate and is manufactured to IPC 6012 Class 2 standards based on provided Gerber files. The design incorporates a polyimide stiffener at the insertion head for enhanced durability. |
|
|
|
|
|
Parameter and Data Sheet |
|
|
Size of Flexible PCB |
230.5 X 40.8mm |
Number of Layers |
1 |
Board Type |
Flexible PCB |
Board Thickness |
0.20mm |
Board Material |
Polyimide (PI) 25µm |
Board Material Supplier |
ITEQ |
Tg Value of Board Material |
60℃ |
|
PTH Cu thickness |
≥20 µm |
Inner Iayer Cu thicknes |
N/A |
Surface Cu thickness |
35µm (1oz) |
|
Coverlay Colour |
Yellow |
Number of Coverlay |
1 |
Thickness of Coverlay |
25 µm |
Stiffener Material |
Polyimide |
Stiffener Thickness |
0.2mm |
|
Type of Silkscreen Ink |
IJR-4000 MW300 |
Supplier of Silkscreen |
TAIYO |
Color of Silkscreen |
White |
Number of Silkscreen |
1 |
|
Peeling test of Coverlay |
No peelable |
Legend Adhesion |
3M 90℃ No peeling after Min. 3 times test |
|
Surface Finish |
Immersion Gold |
Thickness of Nickle/Gold |
Au: 0.03µm(Min.); Ni 2-4µm |
RoHS Required |
Yes |
Famability |
94-V0 |
|
Thermal Shock Test |
Pass, -25℃±125℃, 1000 cycles. |
Thermal Stress |
Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
Function |
100% Pass electrical test |
Workmanship |
Compliance with IPC-A-600H & IPC-6013C Class 2 |
|
|
|
|
|
|
.jpg) |
|
|
|
|
|
Features and Benefits
1. Excellent flexibility
2. Reducing the volume
3. Weight reduction
4. Consistency of assembly
5. Increased reliability
6. Low cost
7. Continuity of processing
8. Focus on low to medium volume production
9. More than 20 years of experience |
|
|
|
|
|
Applications |
|
|
Mobile phone built-in antenna FPC, flex keyboard for mobile phone keys, Industrial control computer soft board |
|
|
|
|
|
Stiffener |
|
|
Flexible circuits with soldered components often incorporate external stiffeners (also called reinforcing boards) to provide mechanical support. These reinforcement layers typically utilize materials such as polyimide (PI) film, polyester film, fiberglass, polymer composites, steel foil, or aluminum shims, depending on specific application requirements. The stiffeners enhance structural integrity while maintaining the board's flexible characteristics in unsupported areas. |
|
|
|
|
|
(1)PI or Polyester |
|
|
Polyimide (PI) and polyester films serve as widely adopted stiffener materials in flexible circuit applications, with 125μm (5mil) being the standard thickness that provides adequate rigidity while maintaining flexibility. These polymer-based reinforcements offer optimal balance between structural support and bendability in FPC designs. |
|
|
|
|
|
(2)Glass fibers |
|
|
Fiberglass-based stiffeners (including FR-4) represent another prevalent reinforcement option for flexible circuits, offering superior rigidity compared to PI or polyester films. These materials are typically employed in applications demanding enhanced structural support, with available thicknesses ranging from 125μm (5mil) to 3.175mm (125mils). While providing greater mechanical strength, fiberglass stiffeners present more challenging processing requirements than polymer films and may exceed the fabrication capabilities of certain FPC manufacturers. |
|
|
|
|
|
(3)Polymer |
|
|
Polymer-based stiffeners, including various plastic composites, offer distinct advantages for flexible circuit reinforcement. These materials combine excellent moisture resistance with superior performance under high-pressure and high-temperature conditions, making them suitable for demanding applications where environmental stability is critical. |
|
|
|
|
|
(4)Steel foil, aluminum shim |
|
|
Metal stiffeners including steel foil and aluminum shims provide superior mechanical rigidity and excellent thermal dissipation properties, making them ideal for applications where structural support and heat management are primary design considerations. |
|
|
|
|
|
More Displays of FR-4 Stiffener |
|
|
.jpg) |
|
|
|
|
|
.jpg) |
|
|
|
|
|
|
|
|
|
|
|
Hot Tags:
PI Stiffener Flexible PCB |
0.15mm Flexible Circuit Board |
Single-Layer Flexible PCB |
25µm Polyimide substrate |
Shengyi PI Stiffener Laminate |
|
|
