Optimized Rogers High Frequency PCB RO4730G3 60mil Laminate

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Optimized Rogers High Frequency PCB RO4730G3 60mil Laminate DK3.0 with Immersion Gold for Cellular Base Station Antenna Design

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

Rogers RO4730G3 antenna-grade laminates provide a cost-effective alternative to traditional PTFE-based materials, delivering the mechanical and electrical properties essential for antenna design. Featuring a dielectric constant of 3.0 and a loss tangent of 0.0022 (measured at 2.5 GHz with LoPro Reverse Treated EDC foil), RO4730G3 substrate enables high gain and reduced signal loss. The material also boasts low PIM performance, with values exceeding -160dBc.

Designed for compatibility with standard epoxy and lead-free solder processes, Rogers RO4730G3 PCB simplifies manufacturing by avoiding the special treatments needed for PTFE-based laminates. With a glass transition temperature over 280°C, RO4730G3 substrate ensures excellent thermal stability, plated through-hole reliability, and solder processability, making it a top choice for cellular base station antennas and other high-performance applications.

General description

A double-sided RF PCB utilizing 1.524mm (60mil) RO4730G3 substrate, tailored for cellular base station antenna PCB solutions.

Basic specifications

Base material: RO4730G3 60mil (1.524mm)

Dielectric constant: 3.0+/-0.05

Layer count: 2 layers

Type: Through holes

Format: 110mm x 95mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm

Solder mask | Legend: Green | White

Final PCB height: 1.6 mm

Standard: IPC 6012 Class 2

Packing: 20 pieces are packed for shipment.

Lead time: 7 working days

Shelf life: 6 months

Rogers 4730 (RO4730G3) Data Sheet

RO4730G3 Typical Value
Property	RO4730G3	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.0±0.5	Z		10 GHz 23℃	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign	2.98	Z		1.7 GHz to 5 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0028	Z		10 GHz 23℃	IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ	0.0028	Z		2.5 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+34	Z	ppm/℃	-50 ℃to 150℃	IPC-TM-650 2.5.5.5
Dimensional Stability	<0.4	X, Y	mm/m	after etech +E2/150 ℃	IPC-TM-650 2.4.39A
Volume Resistivity (0.030")	9 X 10⁷		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity (0.030")	7.2 X 10⁵		MΩ	COND A	IPC-TM-650 2.5.17.1
PIM	-165		dBc	50 ohm 0.060"	43 dBm 1900 MHz
Electrical Strength (0.030")	730	Z	V/mil		IPC-TM-650 2.5.6.2
Flexural Strength MD	181 (26.3)		Mpa (kpsi)	RT	ASTM D790
CMD	139 (20.2)		Mpa (kpsi)	RT	ASTM D790
Moisure Absorption	0.093	-	%	48/50	IPC-TM-650 2.6.2.1 ASTM D570
Thermal Conductivity	0.45	Z	W/mK	50℃	ASTM D5470
Coefficient of Thermal Expansion	15.9 14.4 35.2	X Y Z	ppm/℃	-50 ℃to 288℃	IPC-TM-650 2.4.4.1
Tg	>280		℃		IPC-TM-650 2.4.24
Td	411		℃		ASTM D3850
Density	1.58		gm/cm³		ASTM D792
Copper Peel Stength	4.1		pli	1oz,LoPro EDC	IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

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