Rogers TC350 PCB Supplier

WELCOME TO BICHENG

Metal Based High Frequency PCB

Metal based substrate is a combination of metal based high frequency materials. The intermediate medium is made of high frequency materials ( such as PTFE and others), one side is coated with copper foil, the other side is coated with copper base or aluminum base. The PCB made on this kind of modified material, we can call it metal based high frequency PCB.

Parameters
DK @ 10GHz & Tolerance: 2.20+/- 0.03
Thermal Change of DK (ppm/℃） : -48
Loss Tangent, Df@10GHz: 0.001
Thermal Conductivity(W/mk): 0.35
Td （℃）: 476
Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98
Density (g/cm3): 1.80
Volume Resisivity (Mohm.cm) 1x 10^8
Surface Resistivity (Mohm): 1 x 10^8
Moisture Absorption: 0.02
Peel Strength (N/cm) (1oz): 20
Flammability Rating: UL94 V0

Our PCB Capability (F4BTMS220)

PCB Material:	Modified PTFE Copper Clad with Ceramic Filler
Designator:	F4BTMS220
Dielectric constant @ 10GHz:	2.2
Dielectric constant @ 10GHz:	2.2
Layer count:	Single Layer
Copper weight:	0.5oz, 1oz
PCB thickness:	1.2mm - 9.0mm
PCB thickness:	0.047” - 0.354”
Solder mask:	Green, Red, Black, White, Blue etc.
PCB size:	≤400mm X 500mm
Surface finish:	Bare copper, HASL, ENIG, Immersion tin etc.

Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler

Designator of Substrate

Material Composition / Dielectric Layer

Types

DK @ 10GHz & Tolerance

Thermal Change of Dk(ppm/℃)

Loss Tangent, Df@10GHz

Thermal Conductivity (W/mk)

Td (℃)

Coefficient of Thermal Expansion -50℃ -260 ℃ (ppm/℃)

Density (g/cm3):

Volume Resisivity (Mohm.cm)

Surface Resistivity (Mohm)

Moisture Absorption (%)

Peel Strength (N/cm) (1oz)

Flammability Rating

F4BTMS

PTFE/Ceramic/ Superfine woven glass

F4BTMS220

2.20±0.03

-48

0.0010

0.35

476

1.80

1X108

0.02

V-0

F4BTMS294

2.94±0.04

-20

0.0012

0.58

490

2.25

1X108

0.03

V-0

F4BTMS300

3.00±0.04

-20

0.0013

0.58

490

2.28

1X108

0.04

V-0

Type of Metal Base: Aluminum, Copper
Thickness of Metal Base: 1.0mm, 2.0mm, 3.0mm, 4.0mm
Base copper: 0.5oz, 1oz

Thickness and size F4BTMS

Designator of Substrate	Standard Dielectric Thickness(Without the cladding) and Tolerance		Available Copper Foil	Standard Size
F4BTMS	0.127mm(5mil) ±0.0127mm(0.5mil) 0.254mm(10mil) ±0.02mm(1mil) 0.508mm(20mil) ±0.03mm(1.19mil) 0.762mm(30mil) ±0.04mm(1.58mil) 1.016mm(40mil) ±0.05mm(2mil) 1.524mm(60mil) ±0.05mm(2mil) 3.05mm(120mil) ±0.1mm(4mil) 5.08mm(200mil) ±0.127mm(5mil)	Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us.	0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50 Resistance Copper	305mm x 460mm (12" x 18") 460mm x 610mm (18" x 24") 500mm x 600mm (19.7" x 23.6") 915mm x 1220mm (36" x 48")