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Metal-Based-RF-PCB-with-Aluminum-or-Copper-Base-with-Immersion-Gold-for-Shielding-and-Heat-Dissipation  
   
(As PCBs are custom - produced goods, the picture and parameters shown are only intended for reference.)  
   
Brief Introduction  

Metal-based substrates are innovative composites designed for high-frequency applications. These substrates feature a core of high-frequency materials such as PTFE, sandwiched between specialized layers. On one side, a copper foil layer is applied, while the opposite side is coated with either a copper or aluminum base. This unique structure provides exceptional shielding and heat dissipation capabilities, making it ideal for demanding electronic environments. PCBs manufactured using these advanced materials are known as metal-based high-frequency PCBs.

 

Wangling offers a comprehensive range of high-frequency materials, including F4BM, F4BME, F4BTM, F4BTME, and F4BTMS. These materials are available with either aluminum or copper bases, catering to diverse application needs. For detailed specifications, please refer to the table below.

 

F4BM and F4BME series aluminum/copper substrates

 

Model

Metal base

Proportion

Thermal Conductivity

Available thicknesses of Copper or aluminum base

Thickness tolerance of Metal base

Availabe size

F4BM217-AL

Aluminum base

2.7

180 W/mK

0.48mm, 0.98mm, 1.48mm, 1.98mm, 2.98mm, 3.98mm, other thicknessnes are availabe for customization

+0.02mm, -0.05mm

460mm x 610mm (18"x24"), 460mm x 305mm (18"x12")

F4BM220-AL

F4BM233-AL

F4BM245-AL

F4BM255-AL

F4BM265-AL

F4BM275-AL

F4BM294-AL

F4BM300-AL

F4BME217-AL

F4BME220-AL

F4BME233-AL

F4BME245-AL

F4BME255-AL

F4BME265-AL

F4BME275-AL

F4BME294-AL

F4BME300-AL

F4BM217-CU

Red copper brass

8.9

380 W/mK

F4BM220-CU

F4BM233-CU

F4BM245-CU

F4BM255-CU

F4BM265-CU

F4BM275-CU

F4BM294-CU

F4BM300-CU

F4BME217-CU

F4BME220-CU

F4BME233-CU

F4BME245-CU

F4BME255-CU

F4BME265-CU

F4BME275-CU

F4BME294-CU

F4BME300-CU

 

F4BTM and F4BTME series aluminum/copper substrates

 

Model

Metal base

Proportion

Thermal Conductivity

Available thicknesses of Copper or aluminum base

Thickness tolerance of Metal base

Availabe size

F4BTM298-AL

Aluminum base

2.7

180 W/mK

0.48mm, 0.98mm, 1.48mm, 1.98mm, 2.98mm, 3.98mm, other thicknessnes are availabe for customization

+0.02mm, -0.05mm

460mm x 610mm (18"x24"), 460mm x 305mm (18"x12")

F4BTM300-AL

F4BTM320-AL

F4BTM350-AL

F4BTME298-AL

F4BTME300-AL

F4BTME320-AL

F4BTME350-AL

F4BTM298-CU

Red copper brass

8.9

380 W/mK

F4BTM300-CU

F4BTM320-CU

F4BTM350-CU

F4BTME298-CU

F4BTME300-CU

F4BTME320-CU

F4BTME350-CU

 

F4BTMS series aluminum/copper substrates

 

Model

Metal base

Proportion

Thermal Conductivity

Available thicknesses of Copper or aluminum base

Thickness tolerance of Metal base

Availabe size

F4BTMS220-AL

Aluminum base

2.7

180 W/mK

0.48mm, 0.98mm, 1.48mm, 1.98mm, 2.98mm, 3.98mm, other thicknessnes are availabe for customization

+0.02mm, -0.05mm

460mm x 610mm (18"x24"), 460mm x 305mm (18"x12")

F4BTMS233-AL

F4BTMS255-AL

F4BTMS265-AL

F4BTMS294-AL

F4BTMS300-AL

F4BTMS350-AL

F4BTMS430-AL

F4BTMS450-AL

F4BTMS615-AL

F4BTMS1000-AL

F4BTMS220-CU

Red copper brass

8.9

380 W/mK

F4BTMS233-CU

F4BTMS255-CU

F4BTMS265-CU

F4BTMS294-CU

F4BTMS300-CU

F4BTMS350-CU

F4BTMS430-CU

F4BTMS450-CU

F4BTMS615-CU

F4BTMS1000-CU

 
   

Our PCB Capability (F4B **-AL, F4B**-CU)

 

PCB Capability (F4B**-AL / CU)

PCB Material:

PTFEUltra-thin and ultra-fine fiberglass, ceramics.

F4B Aluminum / Copper Base

F4B

DK (10GHz)

DF (10 GHz)

 

F4BM**-AL

2.17 - 3.00

0.001 - 0.0018

 

F4BME**-AL

2.17 - 3.00

0.001 - 0.0018

 

F4BTM**-AL

2.98 - 3.50

0.0018 - 0.0025

 

F4BTME**-AL

2.98 - 3.50

0.0018 - 0.0025

 

F4BTMS**-AL

2.94 -10.2

0.0009-0.0022

 

F4BM**-CU

2.17 - 3.00

0.001 - 0.0018

 

F4BME**-CU

2.17 - 3.00

0.001 - 0.0018

 

F4BTM**-CU

2.98 - 3.50

0.0018 - 0.0025

 

F4BTME**-CU

2.98 - 3.50

0.0018 - 0.0025

 

F4BTMS**-CU

2.94 -10.2

0.0009-0.0022

Layer count:

Single Sided / Single Layer

Copper weight:

1oz (35µm), 2oz (70µm)

Dielectric thickness

0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

 

 
 
   
Hot Tags:

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F4BM and F4BME series aluminum/copper substrates

F4BTM and F4BTME series aluminum/copper substrates

F4BTMS series aluminum/copper substrates

Metal-based substrates

 

 

 

 

 
   
 
                                     
       
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