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Kappa 438 Microwave PCB Board Rogers 40mil 1.016mm High Tg280 PCB for Distributed Antenna Systems |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Brief Introduction |
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Rogers Kappa 438 PCB uniquely integrates with standard FR-4 processes, eliminating PTFE’s specialized costs: it uses conventional drills for 0.15mm microvias (no laser needed), laminates at FR-4’s 170°C/1.5MPa to avoid delamination, and offers 1.2N/mm copper adhesion for reliable wave/reflow soldering—cutting production costs by 90% versus PTFE. This compatibility makes Kappa 438 PCB the only high-frequency laminateviable for mass manufacturing without retooling.
Engineered for precision, it maintains ±1% Dk consistency (2–30 GHz) for tight ±5% impedance control, outperforming FR-4’s unstable Dk while matching its dimensional stability (CTE: 17 ppm/°C). Ideal for cost-sensitive applications like consumer motherboards, automotive BCMs, and industrial panels, Kappa 438 laminate bridges FR-4’s affordability with high-frequency efficiency—no compromise on process familiarity or signal integrity. |
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Features |
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1. Glass reinforced hydrocarbon thermoset platform
2. Dk of 4.38 is tailored to FR-4 industry standard norms
3. Tighter Dk and thickness tolerance than FR-4
4. Low Z Axis CTE of 42 ppm/°C
5. High Tg of > 280°C TMA
6. Meets UL 94-V0 requirements |
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Benefits |
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1. Ease of PCB manufacturing and assembly in Line with FR-4
2. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance
3. Consistent circuit performance
4. Improved design flexibility and plated through-hole reliability
5. Automated assembly compatible |
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.JPG) |
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Typical Applications: |
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1. Carrier Grade WiFi/Licensed Assisted Access (LAA)
2. Small Cell and Distributed Antenna Systems (DAS)
3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)
4. Internet of Things (IoT)
Segments: Smart Home and Wireless Meters |
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Our PCB Capability (Kappa 438) |
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PCB Capability (Kappa 438) |
PCB Material: |
Glass Reinforced Hydrocarbon Ceramic |
Designation: |
Kappa 438 |
Dielectric constant: |
4.38 at 2.5GHz |
Layer count: |
Single Layer, Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35 µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersoin silver, Immersion tin, OSP, ENEPIG, Pure gold etc.. |
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Data Sheet of Kappa 438 Laminate |
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Property |
Typical Value Kappa 438 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant, er Design |
4.38 |
Z |
- |
2.5 GHz |
Differential Phase Length Method |
Dissipation Factor tan, d |
0.005 |
Z |
- |
10 GHz/23°C |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of Dielectric Constant e |
-21 |
- |
ppm/°C |
10 GHz (-50 to 150°C) |
Modified IPC-TM-650 2.5.5.5 |
Volume Resistivity |
2.9 x 109 |
- |
MΩ•cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
6.2 x 107 |
- |
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
675 |
Z |
V/mil |
- |
IPC-TM-650 2.5.6.2 |
Tensile Strength |
16 12 |
MD CMD |
kpsi |
- |
ASTM D3039/D3039-14 |
Flexural Strength |
25 19 |
MD CMD |
kpsi |
- |
IPC-TM-650 2.4.4 |
Dimensional Stability |
-0.48-0.59 |
MD CMD |
mm/m |
- |
IPC-TM-650 2.4.39a |
Coefficient of Thermal Expansion |
13 |
X |
ppm/°C |
-55 to 288°C |
IPC-TM-650 2.4.41 |
16 |
Y |
42 |
Z |
Thermal Conductivity |
0.64 |
Z |
W/(m.K) |
80°C |
ASTM D5470 |
Time to Delamination (T288) |
>60 |
- |
minutes |
288°C |
IPC-TM-650 2.4.24.1 |
Tg |
>280 |
- |
°C TMA |
- |
IPC-TM-650 2.4.24.3 |
Td |
414 |
- |
°C |
- |
IPC-TM-650 2.3.40 |
Moisture Absorption |
0.07 |
- |
% |
24/23 |
IPC-TM-650 2.6.2.1 |
Young’s Modulus |
2264 2098 |
MD CMD |
kpsi |
- |
ASTM D3039/D3039-14 |
Flex Modulus |
2337 2123 |
MD CMD |
kpsi |
- |
IPC-TM-650 2.4.4 |
Bow |
0.03 |
- |
% |
- |
IPC-TM-650 2.4.22C |
Twist |
0.08 |
- |
% |
- |
IPC-TM-650 2.4.22C |
Copper Peel Strength After Thermal Stress |
5.8 |
- |
lbs/in |
1 oz (35 µm) foil |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
- |
- |
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UL 94 |
Specific Gravity |
1.99 |
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g/cm3 |
- |
ASTM D792 |
Lead-Free Process Compatible |
Yes |
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Hot Tags:
High Temperature PCB |
Kappa 438 High Frequency PCB |
Rogers Kappa 438 PCB Material |
Kappa 438 Printed Circuit Board |
Kappa 438 PCB Immersion Gold |
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