(Flex-rigid PCBs are custom-made products. The picture and parameters shown are for reference only.)

This high-performance circuit board utilizes non-flowing 1080 Prepreg combined with high Tg170℃ FR4 substrate to deliver exceptional thermal stability and mechanical reliability in demanding operating conditions. The integration of Panasonic R-F777 Polyimide ensures superior flexibility in the bending sections while maintaining precise board thickness control and consistent impedance characteristics, making it ideal for applications requiring uncompromising signal integrity.

Optimized 2+10 Layer Symmetrical Architecture Featuring a balanced 2 flexible layers + 10 rigid layers construction, this design significantly enhances mechanical durability during dynamic flexing operations while minimizing signal interference. The symmetrical stackup configuration provides improved bending reliability (exceeding 100,000 cycles), reduced electromagnetic interference, and stable signal transmission performance - essential for cutting-edge, high-frequency electronic devices.

1. Key Process Parameters

• Flex Material: Panasonic R-F777 Polyimide (PI) with excellent high-temperature resistance and bend durability (>1,000,000 cycles), ideal for dynamic flex applications.

• Rigid Material: High Tg170℃ FR4 substrate combined with non-flowing 1080 prepreg for superior interlayer adhesion and dimensional stability.

• Unit Size: 110mm × 51mm (1PC)

• Panel Design: 4-up panel (230mm × 142mm) for enhanced production efficiency and assembly convenience.

• Inner Layer Cu: 0.5oz (18μm)

• Outer Layer Cu: 1oz (35μm)

• Surface Finish: ENIG + green solder mask/white legend for reliable soldering and clear marking.

• Thickness Control: Finished board thickness 1.6mm ±10%, strictly meeting assembly specifications.

2. Precision Impedance Control

• 50Ω Single-Ended Lines:

Layer: Signal Layer 4 (L4)

Reference: Upper layer L3

Trace Width: 8mil (0.2mm), simulation-optimized for ±10% tolerance

• Signal Integrity: Validated through HFSS/CST simulation + TDR measurement for high-speed performance.

3. Advanced Processes and Reliability

• Microvias: 0.2mm laser vias with resin filling + copper capping for improved reliability.

• Thermal Performance: High Tg material (Tg≥170℃) supports lead-free soldering and high-temp applications.

• Certification: IPC-6013 Class 3 (highest reliability standard for rigid-flex)

• Reliability Tests:

Thermal stress (288℃, 10s, 3 cycles)

Flex cycling (>10,000 bends)

4-wire resistance testing (100% coverage of open and short circuits)

1. Industrial Automation Solutions

Robotic motion control circuit boards

Precision measurement sensor modules

2. Automotive Electronic Systems

Vehicle-mounted camera control units

Advanced driver assistance system (ADAS) circuit boards

3. Medical and Aerospace Electronics

Portable medical diagnostic equipment

Aviation electronics and spacecraft control systems

4. 5G Communication Infrastructure

Base station RF signal processing modules

Millimeter-wave high-frequency transmission circuits

Prototype delivery guaranteed within 15 days with flexible production arrangements for volume orders

Complete technical documentation including Gerber and IPC-2581 stackup simulation files plus DFM analysis reports

Full customization capabilities for impedance control, material specifications and panel layout optimization