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High-Performance Rogers PCB RT/Duroid 6002 10mil 0.254mm DK2.94 with Immersion Gold for Phased Array Antennas  

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

 
   

Rogers RT/duroid 6002 is a revolutionary microwave material, recognized as the first low loss and low dielectric constant laminate, essential for designing complex microwave structures that are both mechanically reliable and electrically stable. Its thermal coefficient of dielectric constant remains extremely low from -55℃ to +150℃, providing the electrical stability needed for filter, oscillator, and delay line designers in today’s demanding applications.

 

With a low Z-axis coefficient of thermal expansion (CTE), this material ensures reliable plated through holes, having successfully completed over 5,000 temperature cycles (-55℃ to 125℃) without any failures in vias.

 

The material achieves excellent dimensional stability (0.2 to 0.5 mils/inch) by aligning the X and Y coefficients of expansion with copper, often eliminating the need for double etching to achieve tight positional tolerances. Its low tensile modulus (X,Y) reduces stress on solder joints and allows laminate expansion to be constrained by minimal low CTE metal (6 ppm/℃), enhancing surface mount reliability.

 

RT/duroid 6002 is particularly well-suited for applications that leverage its unique properties, including antennas, complex multi-layer circuits with inter-layer connections, and microwave circuits for aerospace applications in hostile environments.

 
   
Typical applications:  

1. Airborne radar systems

2. Beam forming networks

3. Commercial airline collision avoidance

4. Global positioning systems antennas

5. Ground base systems

6. High reliability complex multi-layer circuits

7. Phased array antennas

8. Power backplanes

 
   
PCB Specifications  

 

Rogers RT/Duroid 6002 10mil 0.254mm High Frequency PCB  for Phased Array Antennas

 

 

PCB SIZE

78 x 77 mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

NO

LAYER STACKUP

copper ------- 35um(1 oz)+plate TOP layer

 

RT/duroid 6002 0.254mm

 

copper ------- 35um(1 oz)+plate BOT layer

TECHNOLOGY

 

Minimum Trace and Space:

10 mil / 10 mil

Minimum / Maximum Holes:

0.3 mm / 0.6 mm

Number of Different Holes:

1

Number of Drill Holes:

2

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RT/duroid 6002 0.254mm

Final foil external:

1 oz

Final foil internal:

1 oz

Final height of PCB:

0.3 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion gold (51.3% ) 0.05µm over 3µm nickel

Solder Mask Apply To:

NO

Solder Mask Color:

NO

Solder Mask Type:

NO

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

N/A

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.3mm.

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.

 

 
 
Data Sheet of Rogers 6002 (RT/duroid 6002)

RT/duroid 6002 Typical Value

Property

RT/duroid 6002

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.94±0.04

Z

 

10 GHz/23

IPC-TM-650 2.5.5.5

Dielectric Constant,εDesign

2.94

 

 

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0012

Z

 

10 GHz/23

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

+12

Z

ppm/

10 GHz 0-100

IPC-TM-650 2.5.5.5

Volume Resistivity

106

Z

Mohm.cm

A

ASTM D 257

Surface Resistivity

107

Z

Mohm

A

ASTM D 257

Tensile Modulus

828(120)

X,Y

MPa(kpsi)

23

ASTM D 638

Ultimate Stress

6.9(1.0)

X,Y

MPa(kpsi)

Ultimate Strain

7.3

X,Y

%

Compressive Modulus

2482(360)

Z

MPa(kpsi)

 

ASTM D 638

Moisture Absorption

0.02

 

%

D48/50

IPC-TM-650 2.6.2.1
ASTM D 570

Thermal Conductivity

0.6

 

W/m/k

80

ASTM C518

Coefficient of Thermal Expansion
(-55 to 288)

16
16
24

X
Y
Z

ppm/

23/50% RH

IPC-TM-650 2.4.41

Td

500

 

 TGA

 

ASTM D 3850

Density

2.1

 

gm/cm3

 

ASTM D 792

Specific Heat

0.93(0.22)

 

j/g/k
(BTU/ib/OF)

 

Calculated

Copper Peel

8.9(1.6)

 

Ibs/in.(N/mm)

 

IPC-TM-650 2.4.8

Flammability

V-0

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 

 

 

 
   
   
   
Hot Tags:

2-Layer RT/duroid 6002 PCB

Low CTE RT/duroid 6002 Substrate

RT/duroid 6002 Low TCDK Material

RT/duroid 6002 Loss Tangent

RT/duroid 6002 High Frequency PCB

 

 

 

 

 
   
 
                                     
       
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