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High Frequency PCB Rogers RT/Duroid 5870 (31mil 0.787mm): Ideal for Radar, Superior Performance Guaranteed!  

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

 
   

Rogers RT/duroid 5870 is a high frequency material made of glass microfiber reinforced PTFE composites. It is engineered for demanding stripline and microstrip circuit applications. The uniformity of its dielectric constant, which is quite exceptional, stems from the randomly oriented microfibers within it. The dielectric constant of RT/duroid 5870 shows uniformity across different panels and maintains constancy over a wide spectrum of frequencies. Moreover, its low dissipation factor allows it to be utilized effectively in the Ku-band and higher frequencies. This material, RT/duroid 5870, can be cut, sheared, and machined with ease to achieve the desired shapes. It has a high resistance to all kinds of solvents and reagents, whether they are hot or cold, which are typically employed in processes like etching printed circuits or plating the edges and holes of circuits.

Some of the typical applications where RT/duroid 5870 is used are in commercial airline broadband antennas, microstrip circuits, stripline circuits, millimeter wave applications, military radar systems, missile guidance systems, and point-to-point digital radio antennas.

 
   
 
   
PCB Specifications  

 

PCB SIZE

110 x 72mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 35um(1 oz)+plate TOP layer

 

RT/duroid 5870 0.787mm

 

copper ------- 35um(1oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

4.8 mil / 4.5 mil

Minimum / Maximum Holes:

0.3 mm / 4.6 mm

Number of Different Holes:

5

Number of Drill Holes:

87

Number of Milled Slots:

0

Number of Internal Cutouts:

1

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RT/duroid 5870 0.787mm

Final foil external:

1.0 oz

Final foil internal:

N/A

Final height of PCB:

0.8 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion Gold

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

N/A

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.3mm. Solder mask uncovered

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.

 

 
Data Sheet of Rogers RT/duroid 5870

RT/duroid 5870 Typical Value

Property

RT/duroid 5870

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.33
2.33±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.33

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0005
0.0012

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-115

Z

ppm/

-50to 150

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 107

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

3 x 107

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23)

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23

Test at 100

N/A

MPa(kpsi)

A

ASTM D 638

 

1300(189)

490(71)

X

 

 

 

 

1280(185)

430(63)

Y

 

 

 

Ultimate Stress

50(7.3)

34(4.8)

X

 

 

 

 

42(6.1)

34(4.8)

Y

 

 

 

Ultimate Strain

9.8

8.7

X

%

 

 

 

9.8

8.6

Y

 

 

 

Compressive Modulus

1210(176)

680(99

X

MPa(kpsi)

A

ASTM D 695

 

1360(198)

860(125)

Y

 

 

 

 

803(120)

520(76)

Z

 

 

 

Ultimate Stress

30(4.4)

23(3.4

X

 

 

 

 

37(5.3)

25(3.7)

Y

 

 

 

 

54(7.8)

37(5.3)

Z

 

 

 

Ultimate Strain

4

4.3

X

%

 

 

 

3.3

3.3

Y

 

 

 

 

8.7

8.5

Z

 

 

 

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.22

Z

W/m/k

80

ASTM C 518

Coefficient of Thermal Expansion

22
28
173

X
Y
Z

ppm/

0-100

IPC-TM-650 2.4.41

Td

500

N/A

 TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm3

N/A

ASTM D 792

Copper Peel

27.2(4.8)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A

 
   
   
   
   
   
Hot Tags:

Low Loss RT/duroid 5870

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RT/duroid 5870 Price

2-Layer Low Dissipation PCB

31mil RT/Duroid 5870 Substrate

 

 

 

 

 
   
 
                                     
       
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