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High DK10.2 F4BTMS1000 High-Frequency PCB 3.2mm Low-Dielectric-Loss PTFE Substrates with Immersion Gold |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Brief Introduction |
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This double-sided F4BTMS1000 PCB is designed with circuitry on both the top and bottom layers, each featuring a copper weight of 2oz. The core material is F4BTMS1000, with a thickness of 3.175 mm, positioned as the middle layer. F4BTMS1000 PCB dimensions are 215mm x 145mm, and it is produced as a single unit per panel. It is compatible with surface mount components and does not support through-hole components. The surface finish is Immersion Gold, and a black solder mask is applied to the top side for enhanced durability and aesthetics. Before shipment, each PCB undergoes a 100% Electrical Test to ensure full functionality and compliance with quality standards.
Below is a detailed table summarizing the specifications: |
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F4BTMS1000 High Frequency PCB High DK10.2 PTFE 3.2mm Substrates with Immersion Gold |
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PCB SIZE |
215 x 145mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 70 um(1 oz+plate) TOP layer |
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F4BTMS1000 -3.175 mm |
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copper ------- 70 um(1 oz + plate) BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
12 mil / 12 mil |
Minimum / Maximum Holes: |
0.6 mm / 3.0 mm |
Number of Different Holes: |
6 |
Number of Drill Holes: |
36 |
Number of Milled Slots: |
1 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
F4BTMS1000 Dk10.2 |
Final foil external: |
2oz |
Final foil internal: |
N/A |
Final height of PCB: |
3.2 mm ±10% |
PLATING AND COATING |
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Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Top, Black |
Solder Mask Color: |
no |
Solder Mask Type: |
no |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
Top |
Colour of Component Legend |
White |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated through hole(PTH), minimum size 0.6mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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F4BTMS High Frequency Laminate |
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The F4BTMS series represents an enhanced iteration of the F4BTM series, incorporating substantial technological improvements in both material composition and production techniques. This advanced material integrates a high ceramic content and employs ultra-thin, ultra-fine fiberglass cloth reinforcement, significantly boosting its overall performance. These upgrades have expanded the range of dielectric constants, making it a highly reliable material ideal for aerospace applications and a viable alternative to comparable international products.
By blending a modest amount of ultra-thin, ultra-fine fiberglass cloth reinforcement with a well-distributed mix of specialized nanoceramics and polytetrafluoroethylene resin, the material minimizes the fiberglass effect during electromagnetic wave propagation. This reduction in dielectric loss enhances dimensional stability while decreasing anisotropy across the X/Y/Z axes. As a result, the material supports higher frequency applications, increased electrical strength, and improved thermal conductivity. Additionally, it features a low coefficient of thermal expansion and stable dielectric properties across varying temperatures.
The F4BTMS series is equipped with RTF low-roughness copper foil as standard, which not only reduces conductor loss but also ensures exceptional peel strength. It is compatible with both copper-based and aluminum-based configurations, offering versatility and superior performance. |
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Features |
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Tight dielectric constant tolerance with excellent batch-to-batch consistency.
Ultra-low dielectric loss for superior signal integrity.
Stable dielectric constant and low loss values up to 40 GHz, ideal for phase-sensitive applications.
Excellent temperature stability, with minimal variation in dielectric constant and loss across a wide temperature range from -55°C to 150°C, ensuring reliable frequency and phase stability.
Outstanding radiation resistance, maintaining stable dielectric and physical properties even after high-dose radiation exposure.
Low outgassing performance, tested under vacuum conditions to meet stringent aerospace requirements for material volatilization.
Low thermal expansion coefficient in X/Y/Z directions, ensuring dimensional stability and reliable plated through-hole integrity.
Enhanced thermal conductivity, making it suitable for high-power applications.
Superior dimensional stability for precise manufacturing and assembly.
Low water absorption for consistent performance in humid environments. |
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Typical Applications |
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Aerospace equipment, space, cabin equipment
Microwave, Radio frequency
Radar, military radar
Feed network
Phase-sensitive antenna, phased array antenna
Satellite communications. |
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Our PCB Capability (F4BTMS) |
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PCB Capability (F4BTMS) |
PCB Material: |
PTFE，Ultra-thin and ultra-fine fiberglass, ceramics. |
Designation (F4BTMS ) |
F4BTMS |
DK (10GHz) |
DF (10 GHz) |
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F4BTMS220 |
2.2±0.02 |
0.0009 |
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F4BTMS233 |
2.33±0.03 |
0.0010 |
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F4BTMS255 |
2.55±0.04 |
0.0012 |
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F4BTMS265 |
2.65±0.04 |
0.0012 |
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F4BTMS294 |
2.94±0.04 |
0.0012 |
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F4BTMS300 |
3.0±0.04 |
0.0013 |
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F4BTMS350 |
3.5±0.05 |
0.0016 |
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F4BTMS430 |
4.3±0.09 |
0.0015 |
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F4BTMS450 |
4.5±0.09 |
0.0015 |
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F4BTMS615 |
6.15±0.12 |
0.0020 |
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F4BTMS1000 |
10.2±0.2 |
0.0020 |
Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness |
0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
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Hot Tags:
F4BTMS Series Laminates |
Wangling F4BTMS1000 Substrate |
3.2 mm F4BTMS1000 PCB |
2-Layer Low Dissipation PCB |
PTFE Plate F4BTMS PCB |
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