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FR-4-Stiffener-Flexible-PCB-(FPC)--0.15mm-Thick-Single-Layer-FPCB-stiffener-Flexible- Printed-Circuits-at-Low-Cost |
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(FPC’s are custom-made products. The picture and parameters shown are for reference only.) |
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General description of FR-4 Stiffener Flexible PCB |
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This FR-4 flexible printed circuit is designed for use in Surveillance Systems, constructed as a single layer FPC with a thickness of 0.15mm. The base laminate is provided by Shengyi, and the manufacturing process adheres to IPC 6012 Class 2 standards using the supplied Gerber data. FR-4 material serves as stiffeners on the four tails, while polyimide stiffeners are integrated into the inserting heads. |
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Parameter and Data Sheet |
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Size of Flexible PCB |
230.5 X 30.8mm |
Number of Layers |
1 |
Board Type |
Flexible PCB |
Board Thickness |
0.15mm |
Board Material |
Polyimide (PI) 25µm |
Board Material Supplier |
ITEQ |
Tg Value of Board Material |
60℃ |
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PTH Cu thickness |
≥20 µm |
Inner Iayer Cu thicknes |
N/A |
Surface Cu thickness |
35µm (1oz) |
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Coverlay Colour |
Yellow |
Number of Coverlay |
2 |
Thickness of Coverlay |
25 µm |
Stiffener Material |
Polyimide |
Stiffener Thickness |
0.2mm |
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Type of Silkscreen Ink |
IJR-4000 MW300 |
Supplier of Silkscreen |
TAIYO |
Color of Silkscreen |
White |
Number of Silkscreen |
1 |
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Peeling test of Coverlay |
No peelable |
Legend Adhesion |
3M 90℃ No peeling after Min. 3 times test |
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Surface Finish |
Immersion Gold |
Thickness of Nickle/Gold |
Au: 0.03µm(Min.); Ni 2-4µm |
RoHS Required |
Yes |
Famability |
94-V0 |
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Thermal Shock Test |
Pass, -25℃±125℃, 1000 cycles. |
Thermal Stress |
Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
Function |
100% Pass electrical test |
Workmanship |
Compliance with IPC-A-600H & IPC-6013C Class 2 |
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Features and Benefits
1. Excellent flexibility
2. Reducing the volume
3. Weight reduction
4. Consistency of assembly
5. Increased reliability
6. Low cost
7. Continuity of processing
8. No minimum order quantity and low cost sample. |
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Applications |
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Mobile phone built-in antenna FPC, Mobile phone battery flex board, industrial surveying and mapping instrument |
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Stiffener |
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In numerous applications involving soldered components, flexible circuits often necessitate external stiffeners (also referred to as reinforcing boards) to provide structural support. These stiffeners can be manufactured from various materials, such as PI (polyimide), polyester film, glass fiber, polymeric materials, steel foil, and aluminum shim, among others. |
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(1)PI or Polyester |
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Polyimide (PI) and polyester films represent widely adopted stiffener materials in flexible circuit board applications. These materials typically feature a thickness of 125μm (5mil), a dimension chosen to balance flexibility with structural integrity by imparting a measurable degree of rigidity to the otherwise pliable substrate. |
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(2)Glass fibers |
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Glass fibers, including FR-4, serve as frequently utilized stiffener materials in flexible circuit board applications. These fiberglass stiffeners exhibit greater rigidity compared to PI or polyester alternatives, making them suitable for applications demanding enhanced structural robustness. Their thicknesses generally span from 125μm (5mil) up to 3.175mm (125mils), offering versatility in design. However, fiberglass presents greater manufacturing challenges compared to PI, and it might not be a standard inventory item for all FPC manufacturers due to these processing complexities. |
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(3)Polymer |
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Polymeric materials, including plastics, are also utilized as stiffeners. These materials are noted for their low water absorption properties and their ability to withstand high pressure and elevated temperatures, making them suitable for applications requiring durability under challenging environmental conditions. |
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(4)Steel foil, aluminum shim |
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Steel foil and aluminum shim provide robust structural rigidity and offer effective heat dissipation capabilities. In design considerations, these materials are primarily selected for their high hardness characteristics or their ability to manage thermal transfer, depending on the specific requirements of the application. |
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More Displays of FR-4 Stiffener |
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Hot Tags:
FR-4 Stiffener Flexible PCB |
FR-4 Flexible Printed Circuit |
Single-Layer Flexible PCB |
FR-4 Material PCB |
Shengyi FR-4 Flexible Laminate |
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