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F4BM265-High-Frequency-PCB, DK-2.65-PTFE-Material, 3oz-Copper-Immersion-Gold, Top-Choice-for-RF-Circuit-Boards |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Hello everyone,
Today, let’s dive into the F4BM high-frequency circuit board.
The F4BM series laminates are crafted through a precise scientific formulation and rigorous pressing process, combining fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Compared to the F4B series, the F4BM offers enhanced electrical performance, featuring a broader range of dielectric constants, reduced dielectric loss, higher insulation resistance, and improved stability. This makes it a reliable alternative to similar international products. |
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Basic specifications |
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Layer count: |
Double sided |
Designator |
F4BM265 (DK 2.65) |
Dimension: |
210 x 115mm/1up |
Finished thickness |
1.6mm ±10% |
Finished Copper weight: |
3oz |
SMOBC: |
No |
Surface finish: |
Immersion gold |
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This board is designed as a double-sided PCB, utilizing F4BM265 as the substrate with a DK value of 2.65. It measures 210mm in length and 115mm in width, with a finished thickness of 1.6mm. The board features a 3oz finished copper weight, and it comes without solder mask or silkscreen. The surface finish is immersion gold.
Now, let’s take a closer look at the stack-up. |
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The top and bottom layers are finished with 3oz copper. Sandwiched between these two copper layers is the F4BM265 dielectric material, which has a dielectric constant (DK) of 2.65. |
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As shown in the photo of this board, the traces are noticeably thicker compared to standard boards. The surface finish is immersion gold, and it comes without solder mask or silkscreen. |
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Our PCB Capability (F4BM) |
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PCB Capability (F4BM) |
PCB Material: |
PTFE glass fiber cloth copper clad laminates |
Designation (F4BM ) |
F4BM |
DK (10GHz) |
DF (10 GHz) |
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F4BM217 |
2.17±0.04 |
0.0010 |
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F4BM220 |
2.20±0.04 |
0.0010 |
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F4BM233 |
2.33±0.04 |
0.0011 |
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F4BM245 |
2.45±0.05 |
0.0012 |
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F4BM255 |
2.55±0.05 |
0.0013 |
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F4BM265 |
2.65±0.05 |
0.0013 |
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F4BM275 |
2.75±0.05 |
0.0015 |
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F4BM294 |
2.94±0.06 |
0.0016 |
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F4BM300 |
3.00±0.06 |
0.0017 |
Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness (or overall thickness) |
0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
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The F4BM material offers a wide range of dielectric constants, spanning from 2.17 to 3.0. Board thickness options are versatile, ranging from 0.13mm to 12.0mm. We are equipped to provide comprehensive services, including prototype development, small-batch production, and mass manufacturing.
If you have any inquiries, please don’t hesitate to reach out to us. Thank you for your attention! |
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Appendix: Data Sheet (F4BM) |
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Product Technical Parameters |
Product Model & Data Sheet |
Product Features |
Test Conditions |
Unit |
F4BM217 |
F4BM220 |
F4BM233 |
F4BM245 |
F4BM255 |
F4BM265 |
F4BM275 |
F4BM294 |
F4BM300 |
Dielectric Constant (Typical) |
10GHz |
/ |
2.17 |
2.2 |
2.33 |
2.45 |
2.55 |
2.65 |
2.75 |
2.94 |
3.0 |
Dielectric Constant Tolerance |
/ |
/ |
±0.04 |
±0.04 |
±0.04 |
±0.05 |
±0.05 |
±0.05 |
±0.05 |
±0.06 |
±0.06 |
Loss Tangent (Typical) |
10GHz |
/ |
0.001 |
0.001 |
0.0011 |
0.0012 |
0.0013 |
0.0013 |
0.0015 |
0.0016 |
0.0017 |
20GHz |
/ |
0.0014 |
0.0014 |
0.0015 |
0.0017 |
0.0018 |
0.0019 |
0.0021 |
0.0023 |
0.0025 |
Dielectric Constant Temperature Coefficient |
-55ºC～150ºC |
PPM/℃ |
-150 |
-142 |
-130 |
-120 |
-110 |
-100 |
-92 |
-85 |
-80 |
Peel Strength |
1 OZ F4BM |
N/mm |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
1 OZ F4BME |
N/mm |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>23 |
>23 |
>23 |
>25 |
>25 |
>25 |
>28 |
>30 |
>30 |
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>30 |
>30 |
>32 |
>32 |
>34 |
>34 |
>35 |
>36 |
>36 |
Coefficientof Thermal Expansion |
XY direction |
-55 º~288ºC |
ppm/ºC |
25, 34 |
25, 34 |
22, 30 |
20, 25 |
16, 21 |
14, 17 |
14, 16 |
12, 15 |
12, 15 |
Z direction |
-55 º~288ºC |
ppm/ºC |
240 |
240 |
205 |
187 |
173 |
142 |
112 |
98 |
95 |
Thermal Stress |
260℃, 10s，3 times |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
Water Absorption |
20±2℃, 24 hours |
% |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
Density |
Room Temperature |
g/cm3 |
2.17 |
2.18 |
2.20 |
2.22 |
2.25 |
2.25 |
2.28 |
2.29 |
2.29 |
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
Thermal Conductivity |
Z direction |
W/(M.K) |
0.24 |
0.24 |
0.28 |
0.30 |
0.33 |
0.36 |
0.38 |
0.41 |
0.42 |
PIM |
Only applicable to F4BME |
dBc |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
Flammability |
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UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
Material Composition |
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PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
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Hot Tags:
F4BM265 RF Circuit Board |
F4BM265 High Frequency PCB |
3oz Copper Coating PCB |
F4BM265 PTFE PCB |
DK 2.65 F4BM265 Substrate |
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