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F4BM220-High-Frequency-PCB-3.0mm-PTFE-DK-2.2-with-1oz-Copper-HASL-Lead-Free-for-Superior-Signal-Integrity |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Hi everyone,
Today, let’s discuss a high-frequency circuit board from the F4BM series, specifically designed with a 3.0mm thickness.
The F4BM laminates are manufactured through a precise scientific process, combining fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film under strict pressing conditions. Compared to the F4B series, the F4BM offers enhanced electrical performance, featuring a broader range of dielectric constants, reduced dielectric loss, higher insulation resistance, and improved stability. This makes it a reliable alternative to similar international products. |
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Basic specifications |
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Layer count: |
Double sided |
Base material: |
F4BM220 DK 2.2 |
Dimension: |
61 x 62mm |
Finished thickness |
3.0mm ±10% |
Finished Copper weight: |
1oz |
SMOBC: |
No |
Surface finish: |
HASL Pb free |
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This board is designed as a double-sided PCB, utilizing F4BM220 as the substrate with a dielectric constant (DK) of 2.2. It measures 61mm in length and 62mm in width, with a finished thickness of 3.0mm. The board features a 1.0oz finished copper weight and comes without solder mask or silkscreen. The surface finish is OSP (Organic Solderability Preservative).
Now, let’s take a closer look at the stack-up details: |
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The top and bottom layers are finished with 1oz copper. Positioned between these two copper layers is the F4BM220 dielectric material, which has a dielectric constant (DK) of 2.2 and a thickness of 3.0mm. |
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Here is the photo of this board. The standard color of the F4BM220 PCB is brown. |
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Our PCB Capability (F4BM) |
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PCB Capability (F4BM) |
PCB Material: |
PTFE glass fiber cloth copper clad laminates |
Designation (F4BM ) |
F4BM |
DK (10GHz) |
DF (10 GHz) |
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F4BM217 |
2.17±0.04 |
0.0010 |
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F4BM220 |
2.20±0.04 |
0.0010 |
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F4BM233 |
2.33±0.04 |
0.0011 |
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F4BM245 |
2.45±0.05 |
0.0012 |
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F4BM255 |
2.55±0.05 |
0.0013 |
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F4BM265 |
2.65±0.05 |
0.0013 |
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F4BM275 |
2.75±0.05 |
0.0015 |
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F4BM294 |
2.94±0.06 |
0.0016 |
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F4BM300 |
3.00±0.06 |
0.0017 |
Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness (or overall thickness) |
0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
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The F4BM material provides a broad range of dielectric constants, from 2.17 to 3.0, and offers flexible board thickness options, ranging from 0.13mm to 12.0mm. We are fully capable of delivering end-to-end services, including prototype development, small-scale production, and large-volume manufacturing.
Should you have any questions, feel free to contact us. Thank you for your time and interest! |
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Appendix: Data Sheet (F4BM) |
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Product Technical Parameters |
Product Model & Data Sheet |
Product Features |
Test Conditions |
Unit |
F4BM217 |
F4BM220 |
F4BM233 |
F4BM245 |
F4BM255 |
F4BM265 |
F4BM275 |
F4BM294 |
F4BM300 |
Dielectric Constant (Typical) |
10GHz |
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2.17 |
2.2 |
2.33 |
2.45 |
2.55 |
2.65 |
2.75 |
2.94 |
3.0 |
Dielectric Constant Tolerance |
/ |
/ |
±0.04 |
±0.04 |
±0.04 |
±0.05 |
±0.05 |
±0.05 |
±0.05 |
±0.06 |
±0.06 |
Loss Tangent (Typical) |
10GHz |
/ |
0.001 |
0.001 |
0.0011 |
0.0012 |
0.0013 |
0.0013 |
0.0015 |
0.0016 |
0.0017 |
20GHz |
/ |
0.0014 |
0.0014 |
0.0015 |
0.0017 |
0.0018 |
0.0019 |
0.0021 |
0.0023 |
0.0025 |
Dielectric Constant Temperature Coefficient |
-55ºC~150ºC |
PPM/℃ |
-150 |
-142 |
-130 |
-120 |
-110 |
-100 |
-92 |
-85 |
-80 |
Peel Strength |
1 OZ F4BM |
N/mm |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
1 OZ F4BME |
N/mm |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
Electrical Strength (Z direction) |
5KW,500V/s |
KV/mm |
>23 |
>23 |
>23 |
>25 |
>25 |
>25 |
>28 |
>30 |
>30 |
Breakdown Voltage (XY direction) |
5KW,500V/s |
KV |
>30 |
>30 |
>32 |
>32 |
>34 |
>34 |
>35 |
>36 |
>36 |
Coefficientof Thermal Expansion |
XY direction |
-55 º~288ºC |
ppm/ºC |
25, 34 |
25, 34 |
22, 30 |
20, 25 |
16, 21 |
14, 17 |
14, 16 |
12, 15 |
12, 15 |
Z direction |
-55 º~288ºC |
ppm/ºC |
240 |
240 |
205 |
187 |
173 |
142 |
112 |
98 |
95 |
Thermal Stress |
260℃, 10s,3 times |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
Water Absorption |
20±2℃, 24 hours |
% |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
Density |
Room Temperature |
g/cm3 |
2.17 |
2.18 |
2.20 |
2.22 |
2.25 |
2.25 |
2.28 |
2.29 |
2.29 |
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55~+260 |
-55~+260 |
-55~+260 |
-55~+260 |
-55~+260 |
-55~+260 |
-55~+260 |
-55~+260 |
-55~+260 |
Thermal Conductivity |
Z direction |
W/(M.K) |
0.24 |
0.24 |
0.28 |
0.30 |
0.33 |
0.36 |
0.38 |
0.41 |
0.42 |
PIM |
Only applicable to F4BME |
dBc |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
Flammability |
/ |
UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
Material Composition |
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PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
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Hot Tags:
F4BM220 High Frequency PCB |
3.0mm F4BM220 PCB |
F4BM220 Printed Circuit Board |
F4BM Series Laminates |
F4BM PTFE PCB |
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