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Double Sided Rogers RT/Duroid 5870 20mil 0.508mm High Frequency RF PCB for Millimeter Wave Applications  

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

 
   

Rogers RT/duroid 5870 high frequency material is a type of glass microfiber reinforced PTFE composite, specifically designed for precise stripline and microstrip circuit applications. The outstanding dielectric constant uniformity of this material is due to its randomly oriented microfibers. Notably, the dielectric constant of RT/duroid 5870 remains uniform from one panel to another and is consistent over a broad frequency range. Additionally, its low dissipation factor enables the use of RT/duroid 5870 in the Ku-band and even higher frequency ranges.

RT/duroid 5870 materials can be easily cut, sheared, and machined into various shapes. They possess excellent resistance to all solvents and reagents, whether hot or cold, which are commonly used in the etching of printed circuits or in the plating of edges and holes.

The typical applications of RT/duroid 5870 include commercial airline broadband antennas, microstrip circuits, stripline circuits, millimeter wave applications, military radar systems, missile guidance systems, and point-to-point digital radio antennas, among others.

 
   
 
   
PCB Specifications  

PCB SIZE

99 x 65mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 35um(1 oz)+plate TOP layer

 

RT/duroid 5870 0.508mm

 

copper ------- 35um(1oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

5 mil / 4.5 mil

Minimum / Maximum Holes:

0.3 mm / 4.6 mm

Number of Different Holes:

7

Number of Drill Holes:

105

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RT/duroid 5870 0.508mm

Final foil external:

1.0 oz

Final foil internal:

N/A

Final height of PCB:

0.6 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion Gold

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

n/a

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.3mm. Solder mask uncovered

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.

 

 
Data Sheet of Rogers RT/duroid 5870

RT/duroid 5870 Typical Value

Property

RT/duroid 5870

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.33
2.33±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.33

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0005
0.0012

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-115

Z

ppm/

-50to 150

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 107

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

3 x 107

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23)

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23

Test at 100

N/A

MPa(kpsi)

A

ASTM D 638

 

1300(189)

490(71)

X

 

 

 

 

1280(185)

430(63)

Y

 

 

 

Ultimate Stress

50(7.3)

34(4.8)

X

 

 

 

 

42(6.1)

34(4.8)

Y

 

 

 

Ultimate Strain

9.8

8.7

X

%

 

 

 

9.8

8.6

Y

 

 

 

Compressive Modulus

1210(176)

680(99

X

MPa(kpsi)

A

ASTM D 695

 

1360(198)

860(125)

Y

 

 

 

 

803(120)

520(76)

Z

 

 

 

Ultimate Stress

30(4.4)

23(3.4

X

 

 

 

 

37(5.3)

25(3.7)

Y

 

 

 

 

54(7.8)

37(5.3)

Z

 

 

 

Ultimate Strain

4

4.3

X

%

 

 

 

3.3

3.3

Y

 

 

 

 

8.7

8.5

Z

 

 

 

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.22

Z

W/m/k

80

ASTM C 518

Coefficient of Thermal Expansion

22
28
173

X
Y
Z

ppm/

0-100

IPC-TM-650 2.4.41

Td

500

N/A

 TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm3

N/A

ASTM D 792

Copper Peel

27.2(4.8)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A

 
   
   
   
   
   
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RT/duroid 5870 Datasheet

 

 

 

 

 
   
 
                                     
       
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