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Double Sided Rogers 30mil (0.762mm) RO4350B RF High Frequency PCB for LNCs |
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(Note: Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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RO4350B hydrocarbon ceramic laminates are expertly engineered to provide top-notch high frequency performance while enabling cost-effective circuit production. As operational frequencies rise to 500 MHz and beyond, the variety of laminates at designers' disposal notably diminishes. Fortunately, RO4350B comes to the rescue. It packs the essential properties demanded by designers working on RF microwave circuits, matching networks, and controlled impedance transmission lines. Thanks to its low dielectric loss, RO4350B can be deployed in numerous scenarios where conventional circuit boards falter under the strain of higher operating frequencies. |
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The temperature coefficient of the dielectric constant in RO4350B material is one of the lowest among circuit board materials, ensuring that the dielectric constant remains stable across a wide frequency range. Additionally, RO4350B's thermal coefficient of expansion (CTE) offers significant advantages for PCB designers. Its expansion coefficient closely matches that of copper, resulting in excellent dimensional stability—essential for mixed dielectric multi-layer board constructions. The low Z-axis CTE ensures reliable quality of plated through-holes, even under extreme thermal shock conditions. With a glass transition temperature (Tg) exceeding 280°C, RO4350B maintains stable expansion characteristics throughout all PCB processing temperatures.
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PCB Specifications |
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High Frequency PCB Rogers 30mil 0.762mm RO4350B Double Sided RF Circuit Board for LNCs |
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PCB SIZE |
93 x 92mm=1PCS |
BOARD TYPE |
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Number of Layers |
Double sided PCB, 2 Layer PCB |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 17.8um(0.5oz)+plate TOP layer |
RO4350B 30mil (0.762mm) |
copper ------- 17.8um(1oz)+plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
11.97mil |
Minimum / Maximum Holes: |
0.3/2.8mm |
Number of Different Holes: |
2 |
Number of Drill Holes: |
195 |
Number of Milled Slots: |
5 |
Number of Internal Cutouts: |
0 |
Impedance Control |
No |
BOARD MATERIAL |
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Glass Epoxy: |
RO4350B 30mil (0.762mm), Tg 288℃ |
Final foil external: |
1oz |
Final foil internal: |
0oz |
Final height of PCB: |
0.8mm ±0.1 |
PLATING AND COATING |
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Surface Finish |
Immersion Gold (16.2%) 2 micoinch over 100 microinch nickel |
Solder Mask Apply To: |
NO |
Solder Mask Color: |
NO |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing, Fiducial Marks |
MARKING |
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Side of Component Legend |
NO |
Colour of Component Legend |
NO |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated Through Hole(PTH) |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" (0.15mm) |
Board plating: |
0.0030" (0.076mm) |
Drill tolerance: |
0.002" (0.05mm) |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Typical applications: |
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Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID |
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Data sheet of Rogers 4350B (RO4350B ) |
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RO4350B Typical Value |
Property |
RO4350B |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.48±0.05 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3.66 |
Z |
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8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factortan,δ |
0.0037
0.0031 |
Z |
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10 GHz/23℃
2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+50 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.2 x 1010 |
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MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
5.7 x109 |
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MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
16,767(2,432)
14,153(2,053) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Tensile Strength |
203(29.5)
130(18.9) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Flexural Strength |
255
(37) |
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MPa
(kpsi) |
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IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.5 |
X,Y |
mm/m
(mil/inch) |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
10
12
32 |
X
Y
Z |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
Tg |
>280 |
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℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
390 |
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℃ TGA |
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ASTM D 3850 |
Thermal Conductivity |
0.69 |
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W/M/oK |
80℃ |
ASTM C518 |
Moisture Absorption |
0.06 |
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% |
48hrs immersion 0.060"
sample Temperature 50℃ |
ASTM D 570 |
Density |
1.86 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
0.88
(5.0) |
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N/mm
(pli) |
after solder float 1 oz.
EDC Foil |
IPC-TM-650 2.4.8 |
Flammability |
(3)V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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