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Double-Layer Rogers 3006 50mil 1.27mm Microwave PCB Rogers RO3006 RF Printed Circuit Board with ENIG |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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The Rogers RO3006 high - frequency circuit materials, which are ceramic - filled PTFE composites, are targeted for use in commercial microwave and RF applications. They are designed to offer remarkable electrical and mechanical stability at prices that are competitive in the market. The consistent mechanical properties make it possible for designers to create multi - layer board designs without having to face problems such as warpages or reliability issues. RO3006 materials demonstrate a coefficient of thermal expansion (CTE) of 17 ppm/℃ in the X and Y axes. This expansion coefficient corresponds to that of copper, allowing the material to show excellent dimensional stability. After the etching and baking processes, the typical etch shrinkage is less than 0.5 mils per inch. The Z - axis CTE of 24 ppm/℃ provides outstanding plated through - hole reliability, even in the most demanding environments. |
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Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers |
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PCB Specifications |
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Rogers RO3006 50mil 1.270mm High Frequency PCB DK6.15 RF PCB Board for Power Backplanes |
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PCB SIZE |
98 x 98mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RO3006 1.270mm |
copper ------- 18um(0.5 oz) + plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
4 mil / 4 mil |
Minimum / Maximum Holes: |
0.3mm / 2.2mm |
Number of Different Holes: |
n/a |
Number of Drill Holes: |
n/a |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RO3006 1.270mm |
Final foil external: |
1 oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.4 mm ±0.14mm |
PLATING AND COATING |
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Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Bottom, 12micron Minimum |
Solder Mask Color: |
Green, PSR-2000GT600D, Taiyo Supplied. |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
Bottom |
Colour of Component Legend |
White, IJR-4000 MW300, Taiyo brand |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
N/A |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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新2.PNG) |
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Rogers 3006 (RO3006) Data Sheet |
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RO3006 Typical Value |
Property |
RO3006 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
6.15±0.05 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
6.5 |
Z |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.002 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-262 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.27
0.15 |
X
Y |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Volume Resistivity |
105 |
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MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
105 |
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MΩ |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
1498
1293 |
X
Y |
MPa |
23℃ |
ASTM D 638 |
Moisture Absorption |
0.02 |
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% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.86 |
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j/g/k |
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Calculated |
Thermal Conductivity |
0.79 |
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W/M/K |
50℃ |
ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) |
17
17
24 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Td |
500 |
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℃ TGA |
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ASTM D 3850 |
Density |
2.6 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
7.1 |
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Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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Hot Tags:
Rogers RO3006 Laminate |
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