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DK6.15-F4BTMS615-PCB-1.6mm-F4B-Substrate-with-Low-CTE-and-Immersion-Gold-Ideal-for-Aerospace-Applications |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Brief Introduction |
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F4BTMS615 PCB is designed with two copper layers and features a compact dimensions of 171 mm x 58 mm. It accommodates surface mount components exclusively on the top layer. The layer stackup includes a top layer with 35 µm (1 oz) copper, starting from a base of 0.5 oz plating, and is supported by a robust F4BTMS615 core material with a thickness of 1.524 mm at its center. The PCB utilizes immersion gold as the surface finish, with a black solder mask applied to the top side for enhanced protection and aesthetics.
Additional details are provided in the table below. |
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F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate With Immersion Gold |
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PCB SIZE |
171 x 58mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 35 um(0.5 oz+plate) TOP layer |
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F4BTMS615 -1.524 mm |
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copper ------- 35 um(0.5 oz + plate) BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
7 mil / 6 mil |
Minimum / Maximum Holes: |
0.5 mm / 1.5 mm |
Number of Different Holes: |
5 |
Number of Drill Holes: |
27 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
F4BTMS615 Dk6.15 |
Final foil external: |
1oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.6 mm ±10% |
PLATING AND COATING |
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Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Top, Black |
Solder Mask Color: |
no |
Solder Mask Type: |
no |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
Top |
Colour of Component Legend |
White |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated through hole(PTH), minimum size 0.5mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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F4BTMS High Frequency Material |
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The F4BTMS series is a technologically advanced evolution of the F4BTM series, incorporating key improvements in material composition and production methods. This innovative material features a high ceramic content and utilizes ultra-thin, ultra-fine fiberglass cloth reinforcement, significantly enhancing its performance. These enhancements have expanded the dielectric constant range, making it a reliable choice for aerospace applications and a strong competitor to international equivalents.
By combining a precise blend of ultra-thin fiberglass cloth, specialized nanoceramics, and polytetrafluoroethylene resin, the material reduces the fiberglass effect during electromagnetic wave propagation. This results in lower dielectric loss, improved dimensional stability, and reduced anisotropy across the X/Y/Z axes. As a result, the material is ideal for high-frequency applications, offers increased electrical strength, and provides better thermal conductivity. It also exhibits a low coefficient of thermal expansion and maintains stable dielectric properties across temperature variations.
The F4BTMS series includes RTF low-roughness copper foil as standard, which minimizes conductor loss while ensuring excellent peel strength. It is compatible with both copper-based and aluminum-based configurations, delivering versatility and superior performance. |
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Features |
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1. Minimal dielectric constant tolerance with excellent batch-to-batch consistency, ensuring reliable performance across production runs.
2. Extremely low dielectric loss, enhancing signal integrity and efficiency in high-frequency applications.
3. Stable dielectric constant and low loss at frequencies up to 40GHz, meeting the demands of phase-sensitive designs.
4. Superior temperature coefficient of dielectric constant and dielectric loss, maintaining frequency and phase stability from -55°C to 150°C.
5. Exceptional radiation resistance, retaining stable dielectric and physical properties even after exposure to irradiation.
6. Low outgassing performance, compliant with vacuum outgassing standards for aerospace applications.
7. Minimal thermal expansion coefficients in the X/Y/Z directions, ensuring dimensional stability and reliable hole copper connections.
8. Improved thermal conductivity, making it suitable for high-power applications.
9. Excellent dimensional stability, ensuring consistent performance under varying conditions.
10. Low water absorption, enhancing reliability in humid or challenging environments. |
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Our PCB Capability (F4BTMS) |
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PCB Capability (F4BTMS) |
PCB Material: |
PTFE，Ultra-thin and ultra-fine fiberglass, ceramics. |
Designation (F4BTMS ) |
F4BTMS |
DK (10GHz) |
DF (10 GHz) |
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F4BTMS220 |
2.2±0.02 |
0.0009 |
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F4BTMS233 |
2.33±0.03 |
0.0010 |
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F4BTMS255 |
2.55±0.04 |
0.0012 |
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F4BTMS265 |
2.65±0.04 |
0.0012 |
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F4BTMS294 |
2.94±0.04 |
0.0012 |
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F4BTMS300 |
3.0±0.04 |
0.0013 |
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F4BTMS350 |
3.5±0.05 |
0.0016 |
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F4BTMS430 |
4.3±0.09 |
0.0015 |
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F4BTMS450 |
4.5±0.09 |
0.0015 |
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F4BTMS615 |
6.15±0.12 |
0.0020 |
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F4BTMS1000 |
10.2±0.2 |
0.0020 |
Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness |
0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
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Data Sheet (F4BTMS) |
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Product Technical Parameters |
Product Models & Data Sheet |
Product Features |
Test Conditions |
Unit |
F4BTMS220 |
F4BTMS233 |
F4BTMS255 |
F4BTMS265 |
F4BTMS294 |
F4BTMS300 |
F4BTMS350 |
F4BTMS430 |
F4BTMS450 |
F4BTMS615 |
F4BTMS1000 |
Dielectric Constant (Typical) |
10GHz |
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2.2 |
2.33 |
2.55 |
2.65 |
2.94 |
3.00 |
3.50 |
4.30 |
4.50 |
6.15 |
10.20 |
Dielectric Constant Tolerance |
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±0.02 |
±0.03 |
±0.04 |
±0.04 |
±0.04 |
±0.04 |
±0.05 |
±0.09 |
±0.09 |
±0.12 |
±0.2 |
Dielectric Constant (Design) |
10GHz |
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2.2 |
2.33 |
2.55 |
2.65 |
2.94 |
3.0 |
3.50 |
4.3 |
4.5 |
6.15 |
10.2 |
Loss Tangent (Typical) |
10GHz |
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0.0009 |
0.0010 |
0.0012 |
0.0012 |
0.0012 |
0.0013 |
0.0016 |
0.0015 |
0.0015 |
0.0020 |
0.0020 |
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20GHz |
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0.0010 |
0.0011 |
0.0013 |
0.0014 |
0.0014 |
0.0015 |
0.0019 |
0.0019 |
0.0019 |
0.0023 |
0.0023 |
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40GHz |
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0.0013 |
0.0015 |
0.0016 |
0.0018 |
0.0018 |
0.0019 |
0.0024 |
0.0024 |
0.0024 |
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Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-130 |
-122 |
-92 |
-88 |
-20 |
-20 |
-39 |
-60 |
-58 |
-96 |
-320 |
Peel Strength |
1 OZ RTF copper |
N/mm |
>2.4 |
>2.4 |
>1.8 |
>1.8 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>26 |
>30 |
>32 |
>34 |
>40 |
>40 |
>42 |
>44 |
>45 |
>48 |
>23 |
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>35 |
>38 |
>40 |
>42 |
>48 |
>52 |
>55 |
>52 |
>54 |
>55 |
>42 |
Coefficientof Thermal Expansion (X, Y direction) |
-55 º~288ºC |
ppm/ºC |
40, 50 |
35, 40 |
15, 20 |
15, 20 |
10, 12 |
10, 11 |
10, 12 |
13, 12 |
12, 12 |
10, 12 |
16, 18 |
Coefficientof Thermal Expansion (Z direction) |
-55 º~288ºC |
ppm/ºC |
290 |
220 |
80 |
72 |
22 |
22 |
20 |
47 |
45 |
40 |
32 |
Thermal Stress |
260℃, 10s，3 times |
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No delamination
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Water Absorption |
20±2℃, 24 hours |
% |
0.02 |
0.02 |
0.025 |
0.025 |
0.02 |
0.025 |
0.03 |
0.08 |
0.08 |
0.1 |
0.03 |
Density |
Room Temperature |
g/cm3 |
2.18 |
2.22 |
2.26 |
2.26 |
2.25 |
2.28 |
2.3 |
2.51 |
2.53 |
2.75 |
3.2 |
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
Thermal Conductivity |
Z direction |
W/(M.K) |
0.26 |
0.28 |
0.31 |
0.36 |
0.58 |
0.58 |
0.6 |
0.63 |
0.64 |
0.67 |
0.81 |
Flammability |
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UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
Material Composition |
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PTFE，Ultra-thin and ultra-fine (quartz) fiberglass. |
PTFE，Ultra-thin and ultra-fine fiberglass, ceramics. |
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Hot Tags:
Wangling F4BTMS615 PCB |
F4BTMS Series High Frequency Laminates |
DK6.15 F4BTMS615 PCB |
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F4BTMS615 Dual Layer PCB |
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