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Customized Double Sided 3.0mm F4BTM298 RF PCB Board with Immersion Tin |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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General description
This is a double-sided high-frequency PCB constructed on a 3.0 mm F4BTM298 substrate, designed specifically for patch antenna applications. |
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Basic specifications
Base material: F4BTM298
Dielectric constant: 2.98+/-0.06
Layer count: 2 layers
Type: Through holes
Format: 110mm x 35mm = 1 type = 1 piece
Surface finish: Immersion tin
Copper weight: Outer layer 35 μm
Solder mask / Legend: No / No
Final PCB height: 3.1 mm
Standard: IPC 6012 Class 2
Packing: 20 pieces are packed for shipment.
Lead time: 7 working days
Shelf life: 6 months |
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Applications
Multiplexer, Acoustic Detection Sensors, Radio Frequency, RF Transceiver |
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F4BTM High Frequency Laminates
F4BTM series high-frequency materials are composed of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene resin, produced through scientific formulation and stringent pressing processes.
These products build upon the F4BM dielectric layer, incorporating high-dielectric, low-loss nanoscale ceramics. This results in a higher dielectric constant, improved heat resistance, a lower coefficient of thermal expansion, enhanced insulation resistance, and better thermal conductivity, all while preserving the low-loss characteristics. |
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Our PCB Capability(F4BTM) |
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PCB Capability (F4BTM) |
PCB Material: |
PTFE / glass fiber cloth / Nano-ceramic filler |
Designation (F4BTM ) |
F4BTM |
DK (10GHz) |
DF (10 GHz) |
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F4BTM298 |
2.98±0.06 |
0.0018 |
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F4BTM300 |
3.0±0.06 |
0.0018 |
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F4BTM320 |
3.2±0.06 |
0.0020 |
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F4BTM350 |
3.5±0.07 |
0.0025 |
Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness (or overall thickness) |
0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
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Data Sheets (F4BTM) |
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Product Technical Parameters |
Product Models & Data Sheet |
Product Features |
Test Conditions |
Unit |
F4BTM298 |
F4BTM300 |
F4BTM320 |
F4BTM350 |
Dielectric Constant (Typical) |
10GHz |
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2.98 |
3.0 |
3.2 |
3.5 |
Dielectric Constant Tolerance |
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±0.06 |
±0.06 |
±0.06 |
±0.07 |
Loss Tangent (Typical) |
10GHz |
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0.0018 |
0.0018 |
0.0020 |
0.0025 |
20GHz |
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0.0023 |
0.0023 |
0.0026 |
0.0035 |
Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-78 |
-75 |
-75 |
-60 |
Peel Strength |
1 OZ F4BTM |
N/mm |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
1 OZ F4BTME |
N/mm |
>1.4 |
>1.4 |
>1.4 |
>1.4 |
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>26 |
>30 |
>32 |
>32 |
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>34 |
>35 |
>40 |
>40 |
Coefficientof Thermal Expansion |
XY direction |
-55 º~288ºC |
ppm/ºC |
15，16 |
15，16 |
13，15 |
10，12 |
Z direction |
-55 º~288ºC |
ppm/ºC |
78 |
72 |
58 |
51 |
Thermal Stress |
260℃, 10s，3 times |
No delamination |
No delamination |
No delamination |
No delamination |
Water Absorption |
20±2℃, 24 hours |
% |
≤0.05 |
≤0.05 |
≤0.05 |
≤0.05 |
Density |
Room Temperature |
g/cm3 |
2.25 |
2.25 |
2.20 |
2.20 |
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
Thermal Conductivity |
Z direction |
W/(M.K) |
0.42 |
0.42 |
0.50 |
0.54 |
PIM |
Only applicable to F4BTME |
dBc |
≤-160 |
≤-160 |
≤-160 |
≤-160 |
Flammability |
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UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
Material Composition |
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PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil. |
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Hot Tags:
2-Layer F4BTM298 PTFE Material |
3.0mm F4BTM298 Substrate |
High Dielectric Constant PCB |
F4B Substrate Datasheet |
F4BTM Series Materials |
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