(FPC’s are custom-made products. The picture and parameters shown are for reference only.)

This USB wireless flexible circuit features a 25μm polyimide substrate with 35μm RA copper construction, delivering 100Ω differential impedance through precise 4.7mil/7.9mil trace design. The assembly incorporates dual-thickness FR-4 stiffeners (0.3mm/0.8mm) for connector stability, finished with yellow coverlay and ENIG pads using Shengyi SF202 base material. Manufactured to IPC-6012 Class 2 standards from provided Gerber files, these circuits ship in quantities of 80 pieces per batch.

Features and Benefits

1. Excellent flexibility

2. Reducing the volume

3. Weight reduction

4. High solderability, no stressing of circuit boards and less contamination of PCB surface

5. 16000 square meter workshop

6. Quick and on-time delivery

7. On-time service

8. More than 20 years of PCB experience

Flexible circuits comprise three essential elements: conductive copper foil, dielectric substrate/coverlay materials, and adhesive bonding systems. The copper foil component is available in two primary variants - Electro-Deposited (ED) copper and Rolled-Annealed (RA) copper, each with distinct manufacturing processes and characteristics.

ED copper foil is manufactured through an electroplating process identical to that used for rigid PCBs. This production method creates a microscopically textured surface on one side, enhancing adhesion when bonded to substrate materials. RA copper foil begins as electrolytic cathode copper that undergoes melting, ingot casting, and sequential rolling/annealing processes to achieve precise thickness specifications. Standard copper foil thickness options include 12μm, 18μm, 35μm, and 70μm.

Polyimide films serve as the predominant dielectric substrate and coverlay material in flexible circuit applications. This material is preferred due to its exceptional thermal stability (withstanding soldering temperatures), superior electrical performance characteristics, and excellent chemical resistance. Polyimide is commercially available in standardized thicknesses of 12.5μm, 20μm, 25μm, and 50μm.

The lamination process for flexible circuits differs significantly from rigid PCB manufacturing. While rigid boards utilize prepreg-derived adhesives during lamination, flexible circuits require separate adhesive systems to bond copper foil to dielectric films. The industry employs two principal adhesive categories: thermoplastic and thermoset systems. Material selection depends on both manufacturing process requirements and the intended operational environment of the final flexible circuit application.

More Displays of SF202 FPC Assembly