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Adhesiveless-Flexible-Printed-Circuit-FPC-Built-on-SF202-Polyimide-With-Gold-Plated-for-Tracking-Applications |
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(Flexible printed circuits are custom-made products. The picture and parameters shown are for reference only.) |
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General description |
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This dual-layerSF202 flexible printed circuit (FPC) is constructed from SF202 adhesiveless polyimide material, measuring 85 x 37 mm—engineered to balance modern electronic demands with superior durability and bendability.
Its architecture features 35 micrometer (1 oz) copper layers on both substrates, delivering excellent electrical conductivity while maintaining a streamlined profile. The design incorporates a minimum 20 mil trace and spacing, enabling precise signal routing and efficient layout optimization for compact applications.
With hole diameters ranging from 0.3 mm to 1.0 mm, the SF202 FPC retains a 1 oz final external foil thickness and a total thickness of 0.15 mm (±0.05 mm), blending structural resilience with lightweight flexibility. The immersion gold surface finish enhances soldering compatibility and provides robust oxidation resistance, ensuring consistent performance across rigorous operational environments. |
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FPC Specifications |
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PCB SIZE |
85 x 37mm=1PCS |
Base Material: |
Polyimide |
Number of Layers |
Double sided PCB |
SMT |
SMT |
Through Hole Components |
no |
LAYER STACKUP |
Copper ------- 35um(1oz) |
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Polyimide |
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Copper ------- 35um(1oz) |
Minimum Trace and Space: |
20mil/20mil |
Minimum / Maximum Holes: |
0.3mm/ 1.0mm |
Final foil external: |
1oz |
Final foil internal: |
0oz |
Final height of PCB: |
0.15mm ±0.05 |
Surface Finish |
Immersion gold |
Solder Mask Apply To: |
TOP, bottom |
Solder Mask Color: |
Yellow Coverlay |
CONTOUR/CUTTING |
Punching |
Stiffener: |
N/A |
Side of Component Legend |
NO |
Colour of Component Legend |
NO |
VIA |
Plated Through Hole(PTH) |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Applications |
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- Computer, mobile phone, digital camera, VCR,
- Flat panel display, apparatus and instrument,
- Automotive electronics, etc.. |
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Parameter of SF202 |
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Test Item |
Test Method |
Unit |
IPC Standard |
Typical Value |
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SF202 0512DT |
Peel Strength 90° |
IPC-TM-650,No.2.4.9
Method A
Method C |
N/mm |
≥0.525
≥0.525
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1.2
1.2
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Thermal Stress |
IPC-TM-650,No.2.4.13 |
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Pass |
Pass |
Dimensional Stability |
IPC-TM-650,No.2.2.4
Method B |
% |
±0.2 |
MD: 0.01
TD: 0 |
Chemical Resistance |
IPC-TM-650,No.2.3.2 |
% |
≥80 |
85 |
Moisture Absorption |
IPC-TM-650,No.2.6.2 |
% |
≤2 |
1.3 |
Volume Resistivity |
IPC-TM-650,No.2.5.17 |
MΩ-cm |
≥106 |
4.8×108 |
Surface Resistance |
IPC-TM-650,No.2.5.17 |
MΩ |
≥105 |
1.2×106 |
Dielectric Constant 1GHz |
PC-TM-650,No.2.5.5.9 |
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3.2 |
Dissipation Factor 1GHz |
PC-TM-650,No.2.5.5.9 |
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0.007 |
Bending resistance |
R0.38×4.9N,with cvl |
Times |
- |
>2000 |
Dielectric Strength |
IPC-TM-650,No.2.5.6.2 |
V/μm |
≥80 |
150 |
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FPC Capabilities |
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No. |
Specifications |
Capabilities |
1 |
Board Type |
Single layer, Doulbe layer, Multilayer, Rigid-Flex |
2 |
Base Material |
PI, PET |
3 |
Copper Weight |
0.5oz, 1oz, 2oz |
4 |
LED Maximum Size |
250 x 5000mm |
5 |
General Maximum Size |
250 x 2000mm |
6 |
Board Thickness |
0.03mm-3.0mm |
7 |
Thickness Tolerance |
±0.03mm |
8 |
Mininum Drill Hole |
0.05mm |
9 |
Maximum Drill Hole |
6.5mm |
10 |
Tolerance of Drill Hole |
±0.025mm |
11 |
Thickness of Hole Wall |
≧ 8 um |
12 |
Minimum Track/Gap of Single Layer Board |
0.025/0.03mm |
13 |
Minimum Track/Gap of Double Layer and Multilayer Board |
0.03/0.040mm |
14 |
Etching Tolerance |
±0.02mm |
15 |
Minimum Width of Silk Legend |
≧ 0.125mm |
16 |
Minimum Heigh of Silk Legend |
≧0.75mm |
17 |
Distance from Legend to Pad |
≧0.15mm |
18 |
Distance from Opening Solder Mask of Drill Coverlay to Track |
≧0.03mm |
19 |
Distance from Opening Solder Mask of Punching Coverlay to Track |
≧0.03mm |
20 |
Thickness of Immersion Nickel |
100-300u" |
21 |
Thickness of Immersion Gold |
1-3u" |
22 |
Thicnkess of Immersion Tin |
150-400u" |
23 |
Minimum Electrical Testing Pad |
0.2mm |
24 |
Minimum Tolerance of Outline(Normal Steel Mould Punch) |
±0.1mm |
25 |
Minimum Tolerance of Outline (Precision Steel Mould Punch) |
±0.05mm |
26 |
Mininum Radius of Bevel Angle (Outline) |
0.2mm |
27 |
Stiffner Material |
PI, FR-4, 3M Adhesive, PET, Steel Sheet |
28 |
RoHs |
Yes |
29 |
Solder Mask Colour |
Yellow, White, Black, Green |
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Hot Tags:
SF202 Flexible Printed Circuit |
Dual-layer SF202 FPC |
Adhesiveless PI FPC |
SF202 Adhesiveless Polyimide |
SF202 Polyimide Material |
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