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AD255C High Frequency PCB |
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Rogers' AD255C substrates are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today's wireless antenna markets. They are glass-reinforced, PTFE based composites that provide controlled dielectric constant, low loss performance, and very good passive intermodulation (PIM) performance. AD255C has dielectric constant of 2.55, dissipation factor of 0.0013 at 10 GHz with ED copper and reverse treat copper. They are available from 20 mils to 125 mils.
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PCB Capability (AD255C) |
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| PCB Material: |
Glass-reinforced, PTFE based Composites |
| Designation: |
AD255C |
| Dielectric constant: |
2.55 (10 GHz) |
| Dissipation Factor |
0.0013 (10 GHz) |
| Layer count: |
Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: |
0.5oz (17 μm), 1oz (35μm), 2oz (70μm) |
| Dielectric thickness: |
20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm) |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
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Typical Applications
Automotive telematics antenna systems
Cellular infrastructure base station antenna
Commercial satellite radio antenna |
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Appendix: Typical Value of AD255C |
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| Electrical Properties |
AD255C |
Units |
Test Conditions |
Test Method |
| PIM (30mil/60mil) |
-159/-163 |
dBc |
Reflected 43 dBm swept tones at 1900 MHz, S1/S1 |
Rogers Internal 50 ohm |
| Dielectric Constant (process) |
2.55 |
- |
23°C @ 50% RH |
10 GHz |
IPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3) |
| Dielectric Constant (design) |
2.60 |
- |
C-24/23/50 |
10 GHz |
Microstrip Differential Phase Length |
| Dissipation Factor (process) |
0.0013 |
- |
23°C @ 50% RH |
10 GHz |
IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant |
-110 |
ppm/oC |
0°C to 100°C |
10 GHz |
IPC TM-650 2.5.5.5 |
| Volume Resistivity |
7.4 x 10^8 |
Mohm-cm |
C-96/35/90 |
- |
IPC TM-650 2.5.17.1 |
| Surface Resistivity |
3.6 x 10^7 |
Mohm |
C-96/35/90 |
- |
IPC TM-650 2.5.17.1 |
| Electrical Strength (dielectric strength) |
911 |
V/mil |
- |
- |
IPC TM-650 2.5.6.2 |
| Dielectric Breakdown |
>40 |
kV |
D-48/50 |
X/Y direction |
IPC TM-650 2.5.6 |
| Thermal Properties |
| Decomposition Temperature (Td) |
>500 |
°C |
2hrs @ 105°C |
5% Weight Loss |
IPC TM-650 2.3.40 |
| Coefficient of Thermal Expansion - x |
34 |
ppm/°C |
- |
-55°C to 288°C |
IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y |
26 |
ppm/°C |
- |
-55°C to 288°C |
IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z |
196 |
ppm/°C |
- |
-55°C to 288°C |
IPC TM-650 2.4.41 |
| Thermal Conductivity |
0.35 |
W/mK |
- |
z direction |
ASTM D5470 |
| Time to Delamination |
>60 |
minutes |
as-received |
288°C |
IPC TM-650 2.4.24.1 |
| Mechanical Properties |
| Copper Peel Strength after Thermal Stress |
2.4
(13.6) |
N/mm (lbs/in) |
10s @288?C |
35 μm foil |
IPC TM-650 2.4.8 |
| Flexural Strength (MD/CMD) |
8.8/6.4 (60.7/44.1) |
MPa (ksi ) |
25°C ± 3°C |
- |
ASTM D790 |
| Tensile Strength (MD/CMD) |
8.1/6.6 (55.8/45.5) |
MPa (ksi ) |
23°C/50% RH |
- |
ASTM D3039/D3039-14 |
| Flex Modulus (MD/CMD) |
930/818 (6,412/5,640) |
MPa (ksi ) |
25°C ± 3°C |
- |
IPC-TM-650 Test Method 2.4.4 |
| Dimensional Stability (MD/CMD) |
0.03/0.07 |
mils/inch |
after etch + bake |
- |
IPC-TM-650 2.4.39a |
| Physical Properties |
| Flammability |
V-0 |
- |
- |
- |
UL-94 |
| Moisture Absorption |
0.03 |
% |
E1/105 +D48/50 |
- |
IPC TM-650 2.6.2.1 |
| Density |
2.28 |
g/cm3 |
C-24/23/50 |
- |
ASTM D792 |
| Specific Heat Capacity |
0.813 |
J/g°K |
2 hours at 105°C |
- |
ASTM E2716 |
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