RT/duroid 5870 Typical Value

Property

RT/duroid 5870

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.33
2.33±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.33

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0005
0.0012

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-115

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 10⁷

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

3 x 10⁷

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23)

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23℃

Test at 100℃

N/A

MPa(kpsi)

A

ASTM D 638

1300(189)

490(71)

X

1280(185)

430(63)

Y

Ultimate Stress

50(7.3)

34(4.8)

X

42(6.1)

34(4.8)

Y

Ultimate Strain

9.8

8.7

X

%

9.8

8.6

Y

Compressive Modulus

1210(176)

680(99）

X

MPa(kpsi)

A

ASTM D 695

1360(198)

860(125)

Y

803(120)

520(76)

Z

Ultimate Stress

30(4.4)

23(3.4）

X

37(5.3)

25(3.7)

Y

54(7.8)

37(5.3)

Z

Ultimate Strain

4

4.3

X

%

3.3

3.3

Y

8.7

8.5

Z

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.22

Z

W/m/k

80℃

ASTM C 518

Coefficient of Thermal Expansion

22
28
173

X
Y
Z

ppm/℃

0-100℃

IPC-TM-650 2.4.41

Td

500

N/A

℃ TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm³

N/A

ASTM D 792

Copper Peel

27.2(4.8)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A