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50mil-Rogers-RT/Duroid-6010-High-Frequency-PCB-with-Immersion-Gold-for-Satellite-Communication-Systems |
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(As PCBs are custom - produced goods, the picture and parameters shown are only intended for reference.) |
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Hi Everyone,
Today, we’re exploring the features of Rogers 6010 PCB. The Rogers RT/duroid 6010LM laminate is a ceramic-filled PTFE composite, tailored for microwave and electronic circuits that require a high dielectric constant. Offering a consistent dielectric constant of 10.2, this material ensures excellent signal integrity and performance, making it a top choice for high-frequency applications. |
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PCB Capability (RT/duroid 6010) |
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PCB Material: |
Ceramic-PTFE composite |
Designator: |
RT/duroid 6010LM |
Dielectric constant: |
10.2 ±0.25 (process) |
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10.7 (design) |
Layer count: |
1 Layer, 2 Layer |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 25mil (0.635mm) |
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50mil (1.27mm), 75mil (1.90mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP. |
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RT/duroid 6010LM microwave laminates are designed for easy fabrication and exceptional stability during use. These properties make them ideal for mass production, helping to reduce manufacturing costs. With tight control over dielectric constant and thickness, low moisture absorption, and excellent thermal-mechanical stability, this material ensures consistent performance in demanding applications. |
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Features and Benefits |
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1. High dielectric constant for circuit size reduction |
2. Low loss. Ideal for operating at X-bank or below |
3. Low moisture absorption reducing effects of moisture on electrical loss |
4. Low Z-axis expansion providing reliable PTH in multilayer boards |
4. Tight DK and thickness control for repeatable circuit performance |
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Typical Applications |
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It is widely used in aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communication systems, and related fields. |
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Appendix: Properties of RT/duroid 6010LM laminates |
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RT/duroid 6010 Typical Value |
Property |
RT/duroid 6010 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
10.2±0.25 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped stripline |
Dielectric Constant,εDesign |
10.7 |
Z |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0023 |
Z |
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10 GHz/A |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-425 |
Z |
ppm/℃ |
-50℃-170℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
5 x 105 |
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Mohm.cm |
A |
IPC 2.5.17.1 |
Surface Resistivity |
5 x 106 |
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Mohm |
A |
IPC 2.5.17.1 |
Tensile Properties |
ASTM D638 (0.1/min. strain rate) |
Young's Modulus |
931(135) 559(81) |
X Y |
MPa(kpsi) |
A |
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Ultimate Stress |
17(2.4) 13(1.9) |
X Y |
MPa(kpsi) |
A |
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Ultimate Strain |
9 to 15 7 to 14 |
X Y |
% |
A |
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Compressive Properties |
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ASTM D695 (0.05/min. strain rate) |
Young's Modulus |
2144 (311) |
Z |
MPa(kpsi) |
A |
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Ultimate Stress |
47(6.9) |
Z |
MPa(kpsi) |
A |
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Ultimate Strain |
25 |
Z |
% |
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Flexural Modulus |
4364 (633) 3751 (544) |
X |
MPa(kpsi) |
A |
ASTM D790 |
Ultimate Stress |
36 (5.2) 32 (4.4) |
X Y |
MPa(kpsi) |
A |
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Deformation under load |
0.26 1.3 |
Z Z |
% |
24hr/50℃/7MPa 24hr/150℃/7MPa |
ASTM D261 |
Moisture Absorption |
0.01 |
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% |
D48/50℃ 0.050"(1.27mm) thick |
IPC-TM-650 2.6.2.1 |
Thermal Conductivity |
0.86 |
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W/m/k |
80℃ |
ASTM C518 |
Coefficient of Thermal Expansion |
24
24
47 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.41 |
Td |
500 |
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℃ TGA |
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ASTM D3850 |
Density |
3.1 |
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g/cm3 |
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ASTM D792 |
Specific Heat |
1.00(0.239) |
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j/g/k
(BTU/ib/OF) |
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Calculated |
Copper Peel |
12.3 (2.1) |
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pli (N/mm) |
after solder float |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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Thank you for your reading. |
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