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50mil-2-Layer-Rogers-RO3010-Microwave-PCB-with-Low-Coefficient-of-Thermal-Expansion-for-Power-Amplifiers-and-Antennas |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers RO3010 high-frequency circuit materials are advanced ceramic-filled PTFE composites tailored for microwave and RF applications in commercial settings. They combine superior electrical and mechanical stability with cost efficiency, making them a preferred choice for designers. The materials' consistent mechanical properties support the development of multi-layer boards without warping or reliability challenges. RO3010 exhibits a coefficient of thermal expansion (CTE) of 17 ppm/℃ in the X and Y axes, closely matching copper's CTE, which ensures excellent dimensional stability and minimal etch shrinkage (less than 0.5 mils per inch after etching and baking). The Z-axis CTE of 24 ppm/℃ guarantees robust plated through-hole reliability, even in extreme conditions. |
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Typical applications: |
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1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers |
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PCB Specifications |
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Rogers RO3010 50mil 1.270mm High Frequency PCB for Power Amplifiers and Antennas |
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PCB SIZE |
75 x 80 mm = 1 PCS |
BOARD TYPE |
High Frequency PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RO3010 1.270mm |
copper ------- 18um(0.5 oz)+plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
5.8mil/5.4mil |
Minimum / Maximum Holes: |
0.4mm / 0.6mm |
Number of Different Holes: |
1 |
Number of Drill Holes: |
4 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RO3010 1.270mm |
Final foil external: |
1oz |
Final foil internal: |
0oz |
Final height of PCB: |
1.4mm ± 10% |
PLATING AND COATING |
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Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
TOP |
Solder Mask Color: |
Green |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing, V-cut |
MARKING |
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Side of Component Legend |
TOP |
Colour of Component Legend |
White |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated through hole(PTH) |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of Rogers 3010 (RO3010) |
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RO3010 Typical Value |
Property |
RO3010 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
10.2±0.05 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
11.2 |
Z |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0022 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-395 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.35
0.31 |
X
Y |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Volume Resistivity |
105 |
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MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
105 |
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MΩ |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
1902
1934 |
X
Y |
MPa |
23℃ |
ASTM D 638 |
Moisture Absorption |
0.05 |
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% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.8 |
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j/g/k |
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Calculated |
Thermal Conductivity |
0.95 |
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W/M/K |
50℃ |
ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) |
13
11
16 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Td |
500 |
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℃ TGA |
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ASTM D 3850 |
Density |
2.8 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
9.4 |
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Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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Rogers RO3010 DK |
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