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31mil 0.787mm Rogers RT/Duroid 5880 High Frequency PCB for Point to Point Digital Radio Antennas |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers RT/duroid 5880 is a high - frequency material par excellence. As a glass microfiber reinforced PTFE composite, it is engineered for the most demanding stripline and microstrip circuit applications. One of its standout features is the exceptional dielectric constant uniformity provided by its randomly oriented microfibers. This leads to a consistent dielectric constant across panels and over a wide frequency spectrum. The low dissipation factor not only extends its usability to the Ku - band and above but also enhances signal integrity.
Additionally, its mechanical workability is remarkable; it can be easily shaped through cutting, shearing, and machining. Plus, its resistance to all common etching and plating solvents makes it a reliable choice for printed circuit manufacturing. Applications span from commercial airline broadband antennas to advanced military and millimeter - wave technologies. |
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PCB Specifications |
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Rogers RT/Duroid 5880 31mil 0.787mm High Frequency PCB for Point to Point Digital Radio Antennas |
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PCB SIZE |
91 x 62mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 35um(1 oz)+plate TOP layer |
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RT/duroid 0.787mm (31 mil) |
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copper ------- 35um(1oz) + plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
4 mil / 4 mil |
Minimum / Maximum Holes: |
0.3 mm / 4.2 mm |
Number of Different Holes: |
9 |
Number of Drill Holes: |
101 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RT/duroid 0.787mm (31 mil) |
Final foil external: |
1 oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.9 mm ±0.1 |
PLATING AND COATING |
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Surface Finish |
Immersion gold |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated through hole(PTH), minimum size 0.3mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of Rogers RT/duroid 5880 |
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RT/duroid 5880 Typical Value |
Property |
RT/duroid 5880 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
2.20
2.20±0.02 spec. |
Z |
N/A |
C24/23/50
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
Dielectric Constant,εDesign |
2.2 |
Z |
N/A |
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0004
0.0009 |
Z |
N/A |
C24/23/50
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
Thermal Coefficient of ε |
-125 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
2 x 107 |
Z |
Mohm cm |
C/96/35/90 |
ASTM D 257 |
Surface Resistivity |
3 x 107 |
Z |
Mohm |
C/96/35/90 |
ASTM D 257 |
Specific Heat |
0.96(0.23） |
N/A |
j/g/k
(cal/g/c) |
N/A |
Calculated |
Tensile Modulus |
Test at 23℃ |
Test at 100℃ |
N/A |
MPa(kpsi) |
A |
ASTM D 638 |
1070(156) |
450(65) |
X |
860(125) |
380(55) |
Y |
Ultimate Stress |
29(4.2) |
20(2.9) |
X |
27(3.9） |
18(2.6) |
Y |
Ultimate Strain |
6 |
7.2 |
X |
% |
4.9 |
5.8 |
Y |
Compressive Modulus |
710(103) |
500(73) |
X |
MPa(kpsi) |
A |
ASTM D 695 |
710(103) |
500(73) |
Y |
940(136) |
670(97) |
Z |
Ultimate Stress |
27(3.9) |
22(3.2) |
X |
29(5.3) |
21(3.1) |
Y |
52(7.5) |
43(6.3) |
Z |
Ultimate Strain |
8.5 |
8.4 |
X |
% |
7.7 |
7.8 |
Y |
12.5 |
17.6 |
Z |
Moisture Absorption |
0.02 |
N/A |
% |
0.62"(1.6mm) D48/50 |
ASTM D 570 |
Thermal Conductivity |
0.2 |
Z |
W/m/k |
80℃ |
ASTM C 518 |
Coefficient of Thermal Expansion |
31
48
237 |
X
Y
Z |
ppm/℃ |
0-100℃ |
IPC-TM-650 2.4.41 |
Td |
500 |
N/A |
℃ TGA |
N/A |
ASTM D 3850 |
Density |
2.2 |
N/A |
gm/cm3 |
N/A |
ASTM D 792 |
Copper Peel |
31.2(5.5) |
N/A |
Pli(N/mm) |
1oz(35mm)EDC foil
after solder float |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
N/A |
N/A |
N/A |
UL 94 |
Lead-free Process Compatible |
Yes |
N/A |
N/A |
N/A |
N/A |
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