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3.0mm-Double-Layer-F4BTME300-High-Frequency-PCB, PTFE-RF-Board-with-Immersion-Silver, Optimized-for-RF-Applications |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Hello everyone,
Today, let’s explore the F4BTME circuit board, specifically the F4BTME300 High Frequency PCB.
This PCB measures 170 mm x 95 mm and is designed as a double-sided, two-layer board. It supports surface-mount components but does not accommodate through-hole components in this configuration. The stack-up includes a top layer with 35 µm (1 oz) copper, starting with a 0.5 oz base plating, paired with a 3.0 mm thick F4BTME300 core material. The bottom layer also features 35 µm (1 oz) copper with plating. The board utilizes immersion silver for superior solderability and protection. Notably, this design does not include a solder mask, providing direct access to the copper layers for enhanced functionality. |
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Basic specifications |
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F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion Silver |
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PCB SIZE |
170 x 95mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 35um(0.5 oz+plate )TOP layer |
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F4BTME300 -3.0mm |
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copper ------- 35um(0.5 oz + plate) BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
7 mil / 7 mil |
Minimum / Maximum Holes: |
0.5 mm / 0.6 mm |
Number of Different Holes: |
5 |
Number of Drill Holes: |
16 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
2 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
F4BTME300 DK 3.0 |
Final foil external: |
1oz |
Final foil internal: |
N/A |
Final height of PCB: |
3.1 mm ±10% |
PLATING AND COATING |
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Surface Finish |
Immersion silver |
Solder Mask Apply To: |
no |
Solder Mask Color: |
no |
Solder Mask Type: |
no |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
NO |
Colour of Component Legend |
NO |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Non-Plated through hole(PTH), minimum size 0.5mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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The standard color of the F4BTME300 PCB is brown. |
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F4BTME High Frequency Laminates |
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The F4BTME series laminates are produced through a precise and scientific process, combining glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin.
These substrates are based on the F4BM dielectric layer and are enhanced with high dielectric constant, low-loss nano-ceramics. This combination delivers improved dielectric properties, excellent heat resistance, a lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, all while maintaining low-loss performance.
Additionally, F4BTME laminates are paired with reverse-treated RTF copper foil, ensuring outstanding performance in passive intermodulation (PIM), precise line control, and reduced conductor loss.
The dielectric constant ranges from 2.98 to 3.5, with ED copper foil available in 0.5 oz, 1 oz, 1.5 oz, and 2 oz, and RTF copper foil available in 0.5 oz and 1 oz. The thickness options range from 0.254 mm to 12.0 mm. |
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Data Sheet (F4BTME300) |
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Product Technical Parameters |
Product Models & Data Sheet |
Product Features |
Test Conditions |
Unit |
F4BTME298 |
F4BTME300 |
F4BTME320 |
F4BTME350 |
Dielectric Constant (Typical) |
10GHz |
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2.98 |
3.0 |
3.2 |
3.5 |
Dielectric Constant Tolerance |
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±0.06 |
±0.06 |
±0.06 |
±0.07 |
Loss Tangent (Typical) |
10GHz |
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0.0018 |
0.0018 |
0.0020 |
0.0025 |
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20GHz |
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0.0023 |
0.0023 |
0.0026 |
0.0035 |
Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-78 |
-75 |
-75 |
-60 |
Peel Strength |
1 OZ F4BTM |
N/mm |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
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1 OZ F4BTME |
N/mm |
>1.4 |
>1.4 |
>1.4 |
>1.4 |
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>26 |
>30 |
>32 |
>32 |
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>34 |
>35 |
>40 |
>40 |
Coefficientof Thermal Expansion |
XY direction |
-55 º~288ºC |
ppm/ºC |
15，16 |
15，16 |
13，15 |
10，12 |
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Z direction |
-55 º~288ºC |
ppm/ºC |
78 |
72 |
58 |
51 |
Thermal Stress |
260℃, 10s，3 times |
No delamination |
No delamination |
No delamination |
No delamination |
Water Absorption |
20±2℃, 24 hours |
% |
≤0.05 |
≤0.05 |
≤0.05 |
≤0.05 |
Density |
Room Temperature |
g/cm3 |
2.25 |
2.25 |
2.20 |
2.20 |
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
Thermal Conductivity |
Z direction |
W/(M.K) |
0.42 |
0.42 |
0.50 |
0.54 |
PIM |
Only applicable to F4BTME |
dBc |
≤-160 |
≤-160 |
≤-160 |
≤-160 |
Flammability |
/ |
UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
Material Composition |
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PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil. |
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Hot Tags:
F4BTME300 PCB |
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F4BTME300 3.0mm PCB |
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F4BTME300 RF PCB |
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