Hello Everyone,

Today, we’re diving into the details of a 5-layer high-frequency PCB constructed using Rogers RO4003C material. This unique design is fabricated using 3 cores of RO4003C, with one layer of copper etched away to achieve the 5-layer structure. Let’s explore its features and applications further!

From the stack-up, we can observe that the basic layer structure is achieved using 3 sheets of 20mil cores. These cores are bonded together by 2 layers of dielectric material (prepreg), resulting in a 5-layer board. The inner layers feature a copper weight of half an ounce, while the outer layers use 1-ounce copper. The final thickness of the board is 2.1mm.

Below is a micro-section image that provides a clear and intuitive view of the board's structure. Note that no solder mask is applied on the surface, and the pads are finished with immersion gold plating.

The stack-up configuration of multilayer PCBs can be customized in numerous ways to meet specific requirements, such as controlled impedance, signal transmission, and other application needs. Within the RO4003C family, designers have a wide range of core thickness options to choose from, including 8mil, 12mil, 16mil, 20mil, 32mil, and 60mil, among others.

The fixed thickness of these cores is crucial for maintaining the precise electrical length of RF lines on the circuit board, ensuring optimal performance.

We offer a diverse selection of high-frequency materials to cater to various design needs. Our portfolio includes Rogers 4000 series, 3000 series, 5000 series, and 6000 series, as well as Taconic TLX series, TLY series, and Chinese F4B series, among others.

If you have any questions or would like to explore these options further, please don’t hesitate to reach out to us. Thank you for your attention, and we look forward to assisting you!

Substrate Types and Brands

Standard FR-4, High Tg FR-4, High Frequency Materials, Polyimide/PET flexible Materials

Shengyi, ITEQ, Isola, Taiwan Union, Rogers Corp. Taconic, Panasonic

Board Types

Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB

CCL Model

High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, IT-180A High CTI FR-4: S1600L, ST115

Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW; CuClad 217, CuClad 233, CuClad 250.

Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30, RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3

Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300; F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300; F4BTM298, F4BTM300, F4BTM320, F4BTM350; F4BTME298, F4BTME300, F4BTME320, F4BTME350; TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500; TF300, TF440, TF600, TF960, TF1020, TF1600; F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000; TFA294, TFA300, TFA615, TFA1020; WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615. Dielectric constant ranges DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2

Maximum Delivery Size 1200mm x 572 mm

Minimum Finished Board Thickness L≤2L: 0.15mm; 4L: 0.4mm

Maximum Finished Board Thickness 10.0 mm

Blind Buried Holes (Non-crossing) 0.1mm

Maximum Hole Aspect Ratio 15:01

Minimum Mechanical Drill Hole Diameter 0.1 mm

Through-hole Tolerance +/- 0.0762 mm

Press-fit Hole Tolerance +/- 0.05mm

Non-plated Copper Hole Tolerance +/- 0.05mm

Maximum Number of Layers 32

Internal and External Layer Maximum Copper Thickness 12Oz

Minimum Drill Hole Tolerance +/- 2mil

Minimum Layer-to-Layer Tolerance +/- 3mil

Minimum Line Width/Spacing 3mil/3mil

Minimum BGA Diameter 8mil

Impedance Tolerance < 50 ±5; ≥50±10%

Surface Treatment Processes Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc.