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20mil-RO3203-Microwave-PCB-2-Layer-Rogers-3203-Circuit-Board-with-Low-Dielectric-Loss-for-Automotive-Collision-Avoidance |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Engineered for high-frequency performance, Rogers RO3203 laminates integrate ceramic-filled substrates with woven fiberglass reinforcement, striking an ideal balance between signal integrity and cost efficiency. Key features include:
Rogers RO3203 PCB offers stable dielectric constant (3.02) and minimal signal loss (0.0016 dissipation factor), which is ideal for 40+ GHz applications.
Hybrid design: Smooth non-woven PTFE surface for fine-line etching + woven-glass rigidity for durability.
Easy fabrication: Compatible with standard PTFE PCB processing.
Multiple copper cladding options (0.5/1/2 oz/ft²) under ISO 9002-certified production.
Perfect for RF/microwave designs demanding precision and reliability.
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Features: |
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1. Woven glass reinforcement improves rigidity for easier handling.
2. Uniform electrical and mechanical performance is ideal for complex multilayer high frequency structures.
3. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz.
4. Excellent mechanical properties over a wide range of dielectric constants are ideal for multilayer board designs.
5. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs
and reliable surface mounted assemblies.
6. Excellent dimensional stability for high production yields.
7. Economically priced for volume manufacturing.
8. Surface smoothness allows for finer line etching tolerances |
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Typical applications: |
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1. Automotive Collision Avoidance Systems
2. Automotive Global Positioning Satellite Antennas
3. Base Station Infrastructure
4. Datalink on Cable Systems
5. Direct Broadcast Satellites
6. LMDS and Wireless Broadband
7. Microstrip Patch Antennas
8. Power Backplanes
9. Remote Meter Readers
10. Wireless Telecommunications Systems |
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PCB Capability (RO3203) |
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PCB Capability (RO3203) |
PCB Material: |
Ceramic-filled Laminates Reinforced with Woven Fiberglass |
Designation: |
RO3203 |
Dielectric constant: |
3.02±0.04 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin and OSP etc.. |
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Data Sheet of RO3203 |
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RO3203 Typical Value |
Property |
RO3203 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.02±0.04 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
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Dissipation Factor,tanδ |
0.0016 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Conductivity |
0.47 (3.2) |
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W/mK |
Float 100℃ |
ASTM C518 |
Volume Resistivity |
107 |
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MΩ.cm |
A |
ASTM D257 |
Surface Resistivity |
107 |
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MΩ |
A |
ASTM D257 |
Dimensional Stability |
0.08 |
X, Y |
mm/m +E2/150 |
after etch |
IPC-TM-650 2.4.3.9 |
Tensile Modulus |
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X Y |
kpsi |
RT |
ASTM D638 |
Flexural Modulus |
400 300 |
X Y |
kpsi |
A |
ASTM D790 |
Tensile Strength |
12.5 13 |
X Y |
kpsi |
RT |
ASTM D638 |
Flexural Strength |
9 8 |
X Y |
kpsi |
A |
ASTM D790 |
Moisure Absorption |
<0.1 |
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% |
D24/23 |
IPC-TM-650 2.6.2.1 |
Coefficient of Thermal Expansion |
58 13 |
Z X,Y |
ppm/℃ |
-50 ℃to 288℃ |
ASTM D3386 |
Td |
500 |
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℃ |
TGA |
ASTM D3850 |
Density |
2.1 |
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gm/cm3 |
23℃ |
ASTM D792 |
Copper Peel Stength |
10 (1.74) |
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lbs/in (N/mm) |
After solder |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead-Free Process Compatible |
Yes |
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Hot Tags:
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