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20mil 30mil 60mil Rogers RO4533 PCB High Frequency Antenna RF Printed Circuit Board with Low Loss |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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General Description |
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Rogers RO4533 PCBs, constructed from a ceramic-filled, glass-reinforced hydrocarbon-based material, present a blend of affordability and high performance. Tailored to fulfill the distinct needs of the antenna markets, RO4533 laminates feature a dielectric constant of 3.3 and a loss tangent (Df) of 0.0025 at 10 GHz. Such attributes empower antenna designers to attain substantial gain while keeping signal loss to a minimum, establishing the Rogers RO4533 PCB as a prime selection for applications requiring exceptional passive intermodulation response, like mobile infrastructure microstrip antennas.
Rogers RO4533 High Frequency PCB serves as a cost-effective alternative to conventional PTFE antenna technologies, enabling designers to achieve an ideal equilibrium between cost and performance. The resin systems of RO4533 dielectric materials are meticulously developed to guarantee optimal antenna performance. With thermal expansion coefficients (CTEs) in both X and Y directions closely aligning with those of copper, Rogers RO4533 substrate efficiently mitigates stresses within printed circuit board antennas, boosting their durability and reliability.
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Features and Benefits |
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1. Low Loss 0.0025 , Low Dk 3.3, low PIM response: Wide range of application use
2. Thermoset resin system: Compatible with standard PCB fabrication
3. Excellent dimensional stability: Greater yield on larger panels sizes
4. Uniform mechanical properties: Maintains mechanical form during handling
5. High thermal conductivity: Improved power handling |
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Typical applications: |
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1. Cellular infrastructure base station antennas
2. WiMAX antenna networks |
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Our PCB Capability (RO4533 PCB) |
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PCB Capability (RO4533) |
PCB Material: |
Ceramic-filled, Glass-reinforced Hydrocarbon |
Designation: |
RO4533 |
Dielectric constant: |
3.3 |
Dissipation Factor |
0.0025 10GHz |
Layer count: |
Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Laminate thickness: |
20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, ENEPIG, Pure gold etc.. |
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RO4533 Typical Values |
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Property |
RO4533 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant, er Process |
3.3 ± 0.08 |
Z |
- |
10 GHz/23℃ 2.5 GHz |
IPC-TM-650,2.5.5.5 |
Dissipation Factor |
0.002 |
Z |
- |
2.5 GHz/23℃ |
IPC-TM-650, 2.5.5.5 |
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0.0025 |
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10 GHz/23℃ |
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PIM (Typical) |
-157 |
- |
dBc |
Reflected 43 dBm swept tones |
Summitek 1900b PIM Analyzer |
Dielectric Strength |
>500 |
Z |
V/mil |
0.51 mm |
IPC-TM-650, 2.5.6.2 |
Dimensional Stability |
<0.2 |
X,Y |
mm/m (mils/inch) |
after etch |
IPC-TM-650, 2.4.39A |
Coefficient of Thermal Expansion |
13 |
X |
ppm/℃ |
-55 to 288℃ |
IPC-TM-650, 2.4.41 |
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11 |
Y |
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37 |
Z |
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Thermal Conductivity |
0.6 |
- |
W/(m.K) |
80℃ |
ASTM C518 |
Moisture Absorption |
0.02 |
- |
% |
D48/50 |
IPC-TM-650, 2.6.2.1 ASTM D570 |
Tg |
>280 |
- |
℃ TMA |
A |
IPC-TM-650, 2.4.24.3 |
Density |
1.8 |
- |
gm/cm3 |
- |
ASTM D792 |
Copper Peel Strength |
6.9 (1.2) |
- |
lbs/in (N/mm) |
1 oz. EDC post solder float |
IPC-TM-650, 2.4.8 |
Flammability |
NON FR |
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- |
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UL 94 |
Lead-Free Process Compatible |
Yes |
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