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20mil 0.508mm Rogers RO4350B Double-Sided RF High-Frequency PCB for Splitter |
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Note: The images and specifications provided are for reference only, as printed circuit boards are custom-made products. |
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RO4350B hydrocarbon ceramic laminates are engineered to deliver exceptional high-frequency performance while maintaining cost-effective circuit fabrication. As operational frequencies rise above 500 MHz, the options for laminate materials available to designers become significantly limited. The RO4350B material includes essential properties for RF microwave circuit design, matching networks, and controlled impedance transmission lines. Its low dielectric loss enables the use of RO4350B in various applications where conventional circuit board materials may fall short due to higher frequency constraints. |
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RO4350B features one of the lowest temperature coefficients of dielectric constant among circuit board materials, ensuring stability across a wide frequency range. Its thermal coefficient of expansion (CTE) closely matches that of copper, providing excellent dimensional stability essential for mixed-dielectric multilayer constructions. The low Z-axis CTE guarantees reliable plated through-hole quality, even in severe thermal shock applications. Furthermore, with a glass transition temperature (Tg) exceeding 280°C, RO4350B maintains stable expansion characteristics throughout the entire range of PCB processing temperatures.
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PCB Specifications |
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High Frequency PCB Rogers 20mil 0.508mm RO4350B Double Sided RF PCB for Splitter |
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PCB SIZE |
26 x 83mm=1PCS |
BOARD TYPE |
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Number of Layers |
Double sided PCB, 2 Layer PCB |
Surface Mount Components |
YES |
Through Hole Components |
no |
LAYER STACKUP |
copper ------- 35um(1oz)+plate TOP layer |
RO4350B 20mil (0.508mm) |
copper ------- 35um(1oz)+plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
5.98mil/6.18mil |
Minimum / Maximum Holes: |
0.3/3.2mm |
Number of Different Holes: |
5 |
Number of Drill Holes: |
431 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
no |
Impedance Control |
no |
BOARD MATERIAL |
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Glass Epoxy: |
RO4350B 20mil (0.508mm), Tg 288℃ |
Final foil external: |
1.5oz |
Final foil internal: |
0oz |
Final height of PCB: |
0.6mm ±0.1 |
PLATING AND COATING |
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Surface Finish |
Immersion Gold (81.1%) 2µ" over 100µ" nickel |
Solder Mask Apply To: |
Top and Bottom, 12micron Minimum |
Solder Mask Color: |
Green, LP-4G G-05, Nanya supplied |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
TOP |
Colour of Component Legend |
White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated Through Hole(PTH) |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" (0.15mm) |
Board plating: |
0.0030" (0.076mm) |
Drill tolerance: |
0.002" (0.05mm) |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Typical applications: |
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Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID |
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Data sheet of Rogers 4350B (RO4350B ) |
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RO4350B Typical Value |
Property |
RO4350B |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.48±0.05 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3.66 |
Z |
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8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factortan,δ |
0.0037
0.0031 |
Z |
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10 GHz/23℃
2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+50 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.2 x 1010 |
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MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
5.7 x109 |
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MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
16,767(2,432)
14,153(2,053) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Tensile Strength |
203(29.5)
130(18.9) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Flexural Strength |
255
(37) |
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MPa
(kpsi) |
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IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.5 |
X,Y |
mm/m
(mil/inch) |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
10
12
32 |
X
Y
Z |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
Tg |
>280 |
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℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
390 |
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℃ TGA |
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ASTM D 3850 |
Thermal Conductivity |
0.69 |
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W/M/oK |
80℃ |
ASTM C518 |
Moisture Absorption |
0.06 |
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% |
48hrs immersion 0.060"
sample Temperature 50℃ |
ASTM D 570 |
Density |
1.86 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
0.88
(5.0) |
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N/mm
(pli) |
after solder float 1 oz.
EDC Foil |
IPC-TM-650 2.4.8 |
Flammability |
(3)V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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